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MJF6388 Datasheet, PDF (1/8 Pages) Motorola, Inc – COMPLEMENTARY SILICON POWER DARLINGTONS 10 AMPERES 100 VOLTS 40 WATTS | |||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MJF6388/D
Complementary Power
Darlingtons
For Isolated Package Applications
Designed for generalâpurpose amplifiers and switching applications, where the
mounting surface of the device is required to be electrically isolated from the heatsink
or chassis.
⢠Isolated Overmold Package, TOâ220 Type
⢠Electrically Similar to the Popular 2N6388, 2N6668, TIP102 and TIP107
⢠100 VCEO(sus)
⢠10 A Rated Collector Current
⢠No Isolating Washers Required
⢠Reduced System Cost
⢠High DC Current Gain â 1000 (Min) @ IC = 5.0 Adc
⢠High Isolation Voltage (up to 4500 VRMS)
⢠Case 221D is UL Recognized at 3500 VRMS: File #E69369
NPN
MJF6388*
PNP
MJF6668*
*Motorola Preferred Devices
COMPLEMENTARY
SILICON
POWER DARLINGTONS
10 AMPERES
100 VOLTS
40 WATTS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ MAXIMUM RATINGS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorâEmitter Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorâBase Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ EmitterâBase Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ RMS Isolation Voltage (1)
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ (for 1 sec, R.H. < 30%, TA = 25_C)
Rating
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorCurrent â Continuous
â Peak(2)
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Base Current
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Total Power Dissipation* @ TC = 25_C
Derate above 25_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Total Power Dissipation @ TA = 25_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Derate above 25_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Operating and Storage Junction Temperature Range
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ THERMAL CHARACTERISTICS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Characteristic
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Thermal Resistance, Junction to Case*
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Thermal Resistance, Junction to Ambient
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Lead Temperature for Soldering Purpose
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ v (1) Proper strike and creepage distance must be provided.
(2) Pulse Test: Pulse Width = 5.0 ms, Duty Cycle 10%.
Test No. 1 Per Figure 14
Test No. 2 Per Figure 15
Test No. 3 Per Figure 16
Symbol
VCEO
VCB
VEB
VISOL
IC
IB
PD
PD
TJ, Tstg
Symbol
RθJC
RθJA
TL
CASE 221Dâ02
UL RECOGNIZED
Value
100
100
5.0
4500
3500
1500
10
15
1.0
40
0.31
2.0
0.016
â 65 to + 150
Unit
Vdc
Vdc
Vdc
V
Adc
Adc
Watts
W/_C
Watts
W/_C
_C
Max
3.2
62.5
260
Unit
_C/W
_C/W
_C
* Measurement made with thermocouple contacting the bottom insulated mounting surface of the package (in a location beneath the die), the device
mounted on a heatsink, thermal grease applied and a mounting torque of 6 to 8 inSlbs.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
©MMoototorroollaa, IBncip. 1o9la95r Power Transistor Device Data
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