MJD47_11 Datasheet, PDF (1/5 Pages) ON Semiconductor – High Voltage Power Transistors

MJD47, MJD50
High Voltage Power
Transistors
DPAK For Surface Mount Applications
Designed for line operated audio output amplifier,
SWITCHMODEt power supply drivers and other switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Electrically Similar to Popular TIP47, and TIP50
• 250 and 400 V (Min) − V_CEO(sus)
• 1 A Rated Collector Current
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• These are Pb−Free Packages
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Collector−Emitter Voltage
V_CEO
Vdc
MJD47
250
MJD50
400
Collector−Base Voltage
V_CB
Vdc
MJD47
350
MJD50
500
Emitter−Base Voltage
Collector Current − Continuous
− Peak
V_EB
5
Vdc
I_C
1
Adc
2
Base Current
Total Power Dissipation
@ T_C = 25°C
Derate above 25°C
I_B
0.6
mAdc
P_D
W
15
0.12
W/°C
Total Power Dissipation (Note 1)
@ T_A = 25°C
Derate above 25°C
P_D
W
1.56
0.0125
W/°C
Operating and Storage Junction
Temperature Range
T_J, T_stg −65 to +150 °C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Thermal Resistance Junction−to−Case
R_qJC
8.33
Thermal Resistance Junction−to−Ambient R_qJA
80
(Note 1)
Unit
°C/W
°C/W
Lead Temperature for Soldering Purpose
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
http://onsemi.com
NPN SILICON POWER
TRANSISTORS
1 AMPERE
250, 400 VOLTS, 15 WATTS
4
12
3
DPAK
CASE 369C
STYLE 1
MARKING DIAGRAM
AYWW
JxxG
A = Assembly Location
Y = Year
WW = Work Week
Jxx = Device Code
xx = 47 or 50
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
January, 2011 − Rev. 10
Publication Order Number:
MJD47/D