MJD31_11 Datasheet, PDF (1/10 Pages) ON Semiconductor – Complementary Power Transistors

MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
Complementary Power
Transistors
DPAK For Surface Mount Applications
Designed for general purpose amplifier and low speed switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
• Straight Lead Version in Plastic Sleeves (“1” Suffix)
• Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
• Electrically Similar to Popular TIP31 and TIP32 Series
• Epoxy Meets UL 94, V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• These are Pb−Free Packages
MAXIMUM RATINGS
Rating
Symbol Max Unit
Collector−Emitter Voltage
V_CEO
Vdc
MJD31, MJD32
40
MJD31C, MJD32C
100
Collector−Base Voltage
V_CB
MJD31, MJD32
MJD31C, MJD32C
Vdc
40
100
Emitter−Base Voltage
Collector Current − Continuous
− Peak
V_EB
5
Vdc
I_C
3
Adc
5
Base Current
Total Power Dissipation @ T_C = 25°C
Derate above 25°C
I_B
1
Adc
P_D
15
W
0.12 W/°C
Total Power Dissipation @ T_A = 25°C
Derate above 25°C
P_D
1.56
W
0.012 _W/°C
Operating and Storage Junction
Temperature Range
T_J, T_stg − 65 to
°C
+ 150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max Unit
Thermal Resistance, Junction−to−Case
R_qJC
8.3
°C/W
Thermal Resistance, Junction−to−Ambient* R_qJA
80
°C/W
Lead Temperature for Soldering Purposes
T_L
260
°C
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
http://onsemi.com
SILICON
POWER TRANSISTORS
3 AMPERES
40 AND 100 VOLTS
15 WATTS
MARKING
DIAGRAMS
12
3
4
DPAK
CASE 369C
STYLE 1
AYWW
J3xxG
1
2
3
4
DPAK−3
CASE 369D
STYLE 1
YWW
J3xxG
A
= Site Code
Y
= Year
WW
= Work Week
xx
= 1, 1C, 2, or 2C
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
February, 2011 − Rev. 8
Publication Order Number:
MJD31/D