MJD2955_13 Datasheet, PDF (1/7 Pages) ON Semiconductor – Complementary Power Transistors

MJD2955 (PNP),
MJD3055 (NPN)
Complementary Power
Transistors
DPAK for Surface Mount Applications
Designed for general purpose amplifier and low speed switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)
• Electrically Similar to MJE2955 and MJE3055
• High Current Gain−Bandwidth Product
• Epoxy Meets UL 94 V−0 @ 0.125 in
• NJV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Base Current
Total Power Dissipation
@ T_C = 25°C
Derate above 25°C
V_CEO
V_CB
V_EB
I_C
I_B
P_D^{
60
70
5
10
6
20
0.16
Vdc
Vdc
Vdc
Adc
Adc
W
W/°C
Total Power Dissipation (Note 1)
@ T_A = 25°C
Derate above 25°C
P_D
1.75
W
0.014
W/°C
Operating and Storage Junction
Temperature Range
T_J, T_stg −55 to +150
°C
ESD − Human Body Model
HBM
3B
V
ESD − Machine Model
MM
C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†Safe Area Curves are indicated by Figure 1. Both limits are applicable and must
be observed.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
http://onsemi.com
SILICON
POWER TRANSISTORS
10 AMPERES
60 VOLTS, 20 WATTS
COMPLEMENTARY
COLLECTOR
2, 4
COLLECTOR
2, 4
1
BASE
3
EMITTER
1
BASE
3
EMITTER
4
4
12
3
DPAK
CASE 369C
STYLE 1
12
3
IPAK
CASE 369D
STYLE 1
MARKING DIAGRAMS
AYWW
J
xx55G
AYWW
J
xx55G
DPAK
IPAK
A
= Assembly Location
Y
= Year
WW = Work Week
Jxx55 = Device Code
x = 29 or 30
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 − Rev. 13
Publication Order Number:
MJD2955/D