MJD243_16 Datasheet, PDF (1/8 Pages) ON Semiconductor – Complementary Silicon Plastic Power Transistors

MJD243 (NPN),
MJD253 (PNP)
Complementary Silicon
Plastic Power Transistors
DPAK−3 for Surface Mount Applications
Designed for low voltage, low−power, high−gain audio amplifier
applications.
Features
• High DC Current Gain
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)
• Low Collector−Emitter Saturation Voltage
• High Current−Gain − Bandwidth Product
• Annular Construction for Low Leakage
• Epoxy Meets UL 94 V−0 @ 0.125 in
• NJV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
Collector Current − Continuous
Collector Current − Peak
Base Current
Total Device Dissipation
@ T_C = 25°C
Derate above 25°C
V_CB
V_CEO
V_EB
I_C
I_CM
I_B
P_D
100
100
7.0
4.0
8.0
1.0
12.5
0.1
Vdc
Vdc
Vdc
Adc
Adc
Adc
W
W/°C
Total Device Dissipation
@ T_A = 25°C (Note 2)
Derate above 25°C
P_D
1.4
W
0.011
W/°C
Operating and Storage Junction
Temperature Range
T_J, T_stg − 65 to +150
°C
ESD − Human Body Model
HBM
3B
V
ESD − Machine Model
MM
C
V
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. When surface mounted on minimum pad sizes recommended.
www.onsemi.com
4.0 A, 100 V, 12.5 W
POWER TRANSISTOR
COMPLEMENTARY
COLLECTOR
2, 4
COLLECTOR
2, 4
1
BASE
3
EMITTER
1
BASE
3
EMITTER
4
12
3
IPAK
CASE 369D
STYLE 1
4
12
3
DPAK−3
CASE 369C
STYLE 1
MARKING DIAGRAMS
AYWW
J253G
AYWW
J2x3G
IPAK
DPAK
A = Assembly Location
Y = Year
WW = Work Week
x = 4 or 5
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
September, 2016 − Rev. 17
Publication Order Number:
MJD243/D