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MGSF2N02EL Datasheet, PDF (1/6 Pages) ON Semiconductor – 2.8 Amps, 20 Volts, N−Channel SOT−23 | |||
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MGSF2N02EL
Preferred Device
Power MOSFET
2.8 Amps, 20 Volts, NâChannel SOTâ23
These miniature surface mount MOSFETs low RDS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry.
Features
⢠PbâFree Packages are Available
⢠Low RDS(on) Provides Higher Efficiency and Extends Battery Life
⢠Miniature SOTâ23 Surface Mount Package Saves Board Space
⢠IDSS Specified at Elevated Temperature
Applications
⢠DCâDC Converters
⢠Power Management in Portable and Battery Powered Products, ie:
Computers, Printers, PCMCIA Cards, Cellular and Cordless
Telephones
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage â Continuous
Drain Current
â Continuous @ TA = 25°C
â Single Pulse (tp = 10 ms)
Total Power Dissipation @ TA = 25°C
Operating and Storage Temperature
Range
VDSS
20
Vdc
VGS
± 8.0
Vdc
A
ID
2.8
IDM
5.0
PD
1.25
W
TJ, Tstg â 55 to
°C
150
Thermal Resistance
JunctionâtoâAmbient (Note 1)
Thermal Resistance
JunctionâtoâAmbient (Note 2)
RqJA
°C/W
100
300
Maximum Lead Temperature for Soldering
TL
Purposes, 1/8â³ from case for 10 seconds
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. 1â Pad, t < 10 sec.
2. Min pad, steady state.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
http://onsemi.com
2.8 A, 20 V
RDS(on) = 85 mW (max)
NâChannel
D
G
S
MARKING
DIAGRAM
3
1
2
SOTâ23
CASE 318
STYLE 21
NT M
NT
= Device Code
M
= Date Code
PIN ASSIGNMENT
3
Drain
1
2
Gate
Source
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 â Rev. 2
Publication Order Number:
MGSF2N02EL/D
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