MGSF1N02L Datasheet, PDF (1/4 Pages) ON Semiconductor – Power MOSFET

MGSF1N02L, MVGSF1N02L
Power MOSFET
750 mAmps, 20 Volts
N−Channel SOT−23
These miniature surface mount MOSFETs low R_DS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc−dc converters and power management in portable
and battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
• Low R_DS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• MVGSF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
V_DSS
20
Vdc
V_GS
± 20
Vdc
Drain Current
− Continuous @ T_A = 25°C
− Pulsed Drain Current (t_p ≤ 10 ms)
Total Power Dissipation @ T_A = 25°C
Operating and Storage Temperature Range
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
I_D
I_DM
P_D
T_J, T_stg
R_qJA
T_L
750
2000
400
− 55 to 150
300
260
mA
mW
°C
°C/W
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
750 mAMPS, 20 VOLTS
R_DS(on) = 90 mW
N−Channel
3
1
2
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
1
SOT−23
CASE 318
N2 M G
G
STYLE 21
1
Gate
2
Source
N2 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and overbar may vary
depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
MGSF1N02LT1G
SOT−23 3000 / Tape &
(Pb−Free)
Reel
MVGSF1N02LT1G* SOT−23 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1996
1
October, 2016 − Rev. 7
Publication Order Number:
MGSF1N02LT1/D