MGSF1N02ELT1 Datasheet, PDF (1/4 Pages) Motorola, Inc – N-CHANNEL LOGIC LEVEL ENHANCEMENT-MODE TMOS MOSFET

MGSF1N02ELT1
Preferred Device
Power MOSFET
750 mAmps, 20 Volts
N−Channel SOT−23
These miniature surface mount MOSFETs low R_DS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc−dc converters and power management in portable
and battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
• Low R_DS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• Pb−Free Package is Available
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
20
Vdc
Gate−to−Source Voltage − Continuous
V_GS
± 8.0
Vdc
Drain Current
− Continuous @ T_A = 25°C
− Pulsed Drain Current (t_p ≤ 10 ms)
mA
I_D
750
I_DM
2000
Total Power Dissipation @ T_A = 25°C
P_D
400
mW
Operating and Storage Temperature Range T_J, T_stg − 55 to 150 °C
Thermal Resistance − Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
R_qJA
T_L
300
°C/W
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
750 mAMPS, 20 VOLTS
R_DS(on) = 85 mW
N−Channel
3
1
2
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
1
SOT−23
NE M G
G
CASE 318
STYLE 21
1
Gate
2
Source
NE = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
MGSF1N02ELT1
Package
Shipping^†
SOT−23 3000/Tape & Reel
MGSF1N02ELT1G SOT−23 3000/Tape & Reel
Pb−Free
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
August, 2006 − Rev. 3
Publication Order Number:
MGSF1N02ELT1/D