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MCR22-6_06 Datasheet, PDF (1/7 Pages) ON Semiconductor – Sensitive Gate Silicon Controlled Rectifiers Reverse Blocking Thyristors | |||
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MCR22â6, MCR22â8
Preferred Device
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed and tested for repetitive peak operation required for CD
ignition, fuel ignitors, flash circuits, motor controls and low-power
switching applications.
Features
⢠150 A for 2 ms Safe Area
⢠High dv/dt
⢠Very Low Forward âOnâ Voltage at High Current
⢠Low-Cost TO-226 (TO-92)
⢠PbâFree Packages are Available*
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Peak Repetitive OffâState Voltage (Note 1) VDRM,
V
(RGK = IK, TJ = *40 to +110°C, Sine Wave, VRRM
50 to 60 Hz, Gate Open)
MCR22â6
400
MCR22â8
600
On-State Current RMS
(180° Conduction Angles, TC = 80°C)
IT(RMS)
1.5
A
Peak Non-repetitive Surge Current,
ITSM
15
A
@TA = 25°C, (1/2 Cycle, Sine Wave, 60 Hz)
Circuit Fusing Considerations (t = 8.3 ms)
I2t
0.9
A2s
Forward Peak Gate Power
(Pulse Width ⤠1.0 msec, TA = 25°C)
Forward Average Gate Power
(t = 8.3 msec, TA = 25°C)
Forward Peak Gate Current
(Pulse Width ⤠1.0 ms, TA = 25°C)
Reverse Peak Gate Voltage
(Pulse Width ⤠1.0 ms, TA = 25°C)
Operating Junction Temperature Range
@ Rated VRRM and VDRM
Storage Temperature Range
THERMAL CHARACTERISTICS
PGM
0.5
W
PG(AV)
0.1
W
IFGM
0.2
A
VRGM
5.0
V
TJ â40 to +110 °C
Tstg â40 to +150 °C
Characteristic
Symbol
Max
Unit
Thermal Resistance, JunctionâtoâCase
RqJC
50
°C/W
Thermal Resistance, JunctionâtoâAmbient RqJA
160
°C/W
Lead Solder Temperature
TL
(Lead Length q 1/16â³ from case, 10 S Max)
+260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
*For additional information on our PbâFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
July, 2006 â Rev. 5
http://onsemi.com
SCRs
1.5 AMPERES RMS
400 thru 600 VOLTS
G
A
K
TOâ92 (TOâ226)
CASE 029
STYLE 10
1
MARKING DIAGRAMS
MCR
22âx
AYWW G
G
MCR22âx = Device Code
x = 6 or 8
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
1
Cathode
2
Gate
3
Anode
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MCR22â6/D
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