MC74HCT573ADWR2G Datasheet, PDF (1/8 Pages) ON Semiconductor – Octal 3-State Noninverting Transparent Latch with LSTTL Compatible Inputs

MC74HCT573A
Octal 3-State Noninverting
Transparent Latch with
LSTTL Compatible Inputs
High−Performance Silicon−Gate CMOS
The MC74HCT573A is identical in pinout to the LS573. This
device may be used as a level converter for interfacing TTL or NMOS
outputs to High−Speed CMOS inputs.
These latches appear transparent to data (i.e., the outputs change
asynchronously) when Latch Enable is high. When Latch Enable goes
low, data meeting the setup and hold times becomes latched.
The Output Enable input does not affect the state of the latches, but
when Output Enable is high, all device outputs are forced to the
high−impedance state. Thus, data may be latched even when the
outputs are not enabled.
The HCT573A is identical in function to the HCT373A but has the
Data Inputs on the opposite side of the package from the outputs to
facilitate PC board layout.
• Output Drive Capability: 15 LSTTL Loads
• TTL/NMOS−Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 10 mA
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7 A
• Chip Complexity: 234 FETs or 58.5 Equivalent Gates
— Improved Propagation Delays
— 50% Lower Quiescent Power
• These Devices are Pb−Free and are RoHS Compliant
20
1
20
1
20
1
20
1
http://onsemi.com
MARKING
DIAGRAMS
20
PDIP−20
N SUFFIX
CASE 738
MC74HCT573AN
AWLYYWWG
1
20
SOIC−20
DW SUFFIX
CASE 751D
HCT573A
AWLYYWWG
1
20
TSSOP−20
DT SUFFIX
CASE 948E
1
HCT
573A
ALYWG
G
20
SOEIAJ−20
F SUFFIX
CASE 967
1
74HCT573A
AWLYWWG
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping^†
MC74HCT573ANG
PDIP−20 18 / Rail
MC74HCT573ADWR2G SOIC−20 1000 / Reel
MC74HCT573ADTR2G TSSOP−20 2500 / Reel
MC74HCT573AFELG SOEIAJ−20 2000 / Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
June, 2011 − Rev. 12
Publication Order Number:
MC74HCT573A/D