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MC33363B_15 Datasheet, PDF (1/11 Pages) ON Semiconductor – High Voltage Switching Regulator | |||
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MC33363B
High Voltage Switching
Regulator
The MC33363B is a monolithic high voltage switching regulator
that is specifically designed to operate from a rectified 240 Vac line
source. This integrated circuit features an onâchip 700 V/1.0 A
SENSEFET® power switch, 500 V active offâline startup FET, duty
cycle controlled oscillator, current limiting comparator with a
programmable threshold and leading edge blanking, latching pulse
width modulator for double pulse suppression, high gain error
amplifier, and a trimmed internal bandgap reference. Protective
features include cycleâbyâcycle current limiting, input undervoltage
lockout with hysteresis, overvoltage protection, and thermal
shutdown. This device is available in a 16âlead dualâinâline and wide
body surface mount packages.
Features
⢠OnâChip 700 V, 1.0 A SENSEFET Power Switch
⢠Rectified 240 Vac Line Source Operation
⢠OnâChip 500 V Active OffâLine Startup FET
⢠Latching PWM for Double Pulse Suppression
⢠CycleâByâCycle Current Limiting
⢠Input Undervoltage Lockout with Hysteresis
⢠OverâVoltage Protection
⢠Trimmed Internal Bandgap Reference
⢠Internal Thermal Shutdown
⢠These are PbâFree Devices*
www.onsemi.com
MARKING
DIAGRAMS
16
1
SOâ16WB
DW SUFFIX
CASE 751N
MC33363BDW
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbâFree Package
PIN CONNECTIONS
Startup Input 1
16
Power Switch
Drain
AC Input
Regulator
Output
8
6
RT
CT 7
Mirror
Osc
PWM
Thermal
Startup Input 1
Startup
Reg
PWM Latch
S
Driver
Q
R
VCC
UVLO
3
Overvoltage
Protection
Input
OVP 11
16
Power Switch
Drain
LEB
Ipk
Compensation
9
DC Output
VCC 3
4
GND
5
RT 6
CT 7
Regulator Output 8
13
GND
12
11
Overvoltage
Protection Input
10
Voltage Feedback
Input
9 Compensation
(Top View)
ORDERING INFORMATION
Device
Package Shippingâ
MC33363BDWG
SOâ16WB
(PbâFree)
47 Units/Rail
MC33363BDWR2G SOâ16WB 1000 Tape & Reel
(PbâFree)
EA
10
GND 4, 5, 12, 13
Voltage
Feedback
Input
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1. Simplified Application
*For additional information on our PbâFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2015
1
February, 2015 â Rev. 11
Publication Order Number:
MC33363B/D
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