MC33363B_10 Datasheet, PDF (1/11 Pages) ON Semiconductor – High Voltage Switching Regulator

MC33363B
High Voltage Switching
Regulator
The MC33363B is a monolithic high voltage switching regulator
that is specifically designed to operate from a rectified 240 Vac line
source. This integrated circuit features an on--chip 700 V/1.0 A
SENSEFET power switch, 500 V active off--line startup FET, duty
cycle controlled oscillator, current limiting comparator with a
programmable threshold and leading edge blanking, latching pulse
width modulator for double pulse suppression, high gain error
amplifier, and a trimmed internal bandgap reference. Protective
features include cycle--by--cycle current limiting, input undervoltage
lockout with hysteresis, overvoltage protection, and thermal
shutdown. This device is available in a 16--lead dual--in--line and wide
body surface mount packages.
Features
 On--Chip 700 V, 1.0 A SENSEFET Power Switch
 Rectified 240 Vac Line Source Operation
 On--Chip 500 V Active Off--Line Startup FET
 Latching PWM for Double Pulse Suppression
 Cycle--By--Cycle Current Limiting
 Input Undervoltage Lockout with Hysteresis
 Over--Voltage Protection
 Trimmed Internal Bandgap Reference
 Internal Thermal Shutdown
 These are Pb--Free Devices*
http://onsemi.com
MARKING
DIAGRAMS
16
1
SO--16WB
DW SUFFIX
CASE 751N
MC33363BDW
AWLYYWWG
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb--Free Package
PIN CONNECTIONS
Startup Input 1
16
Power Switch
Drain
AC Input
Regulator
Output
8
6
R_T
C_{T 7}
Mirror
Osc
PWM
Thermal
Startup Input 1
Startup
Reg
PWM Latch
S
Driver
Q
R
UVLO
OVP
V_CC
3
Overvoltage
Protection
Input
11
16
Power Switch
Drain
LEB
I_pk
Compensation
9
DC Output
V_CC 3
4
GND
5
R_{T 6}
C_T 7
Regulator Output 8
13
GND
12
11
Overvoltage
Protection Input
10
Voltage Feedback
Input
9 Compensation
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
MC33363BDWG
SO--16WB
(Pb--Free)
47 Units/Rail
MC33363BDWR2G SO--16WB 1000 Tape & Reel
(Pb--Free)
EA
10
GND 4, 5, 12, 13
Voltage
Feedback
Input
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1. Simplified Application
*For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2010
1
November, 2010 -- Rev. 9
Publication Order Number:
MC33363B/D