MC14513B_06 Datasheet, PDF (1/10 Pages) ON Semiconductor – BCD−To−Seven Segment Latch/Decoder/Driver CMOS MSI (Low−Power Complementary MOS)

MC14513B
BCD−To−Seven Segment
Latch/Decoder/Driver
CMOS MSI
(Low−Power Complementary MOS)
The MC14513B BCD−to−seven segment latch/decoder/driver is
constructed with complementary MOS (CMOS) enhancement mode
devices and NPN bipolar output drivers in a single monolithic structure.
The circuit provides the functions of a 4−bit storage latch, an 8421
BCD−to−seven segment decoder, and has output drive capability. Lamp
test (LT), blanking (BI), and latch enable (LE) inputs are used to test the
display, to turn−off or pulse modulate the brightness of the display, and
to store a BCD code, respectively. The Ripple Blanking Input (RBI) and
Ripple Blanking Output (RBO) can be used to suppress either leading
or trailing zeroes. It can be used with seven−segment light emitting
diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal
readouts either directly or indirectly.
Applications include instrument (e.g., counter, DVM, etc.) display
driver, computer/calculator display driver, cockpit display driver, and
various clock, watch, and timer uses.
Features
• Low Logic Circuit Power Dissipation
• High−Current Sourcing Outputs (Up to 25 mA)
• Latch Storage of Binary Input
• Blanking Input
• Lamp Test Provision
• Readout Blanking on all Illegal Input Combinations
• Lamp Intensity Modulation Capability
• Time Share (Multiplexing) Capability
• Adds Ripple Blanking In, Ripple Blanking Out to MC14511B
• Supply Voltage Range = 3.0 V to 18 V
• Capable of Driving Two Low−Power TTL Loads, One Low−Power
Schottky TTL Load to Two HTL Loads Over the Rated Temperature
Range
• Pb−Free Package is Available*
MAXIMUM RATINGS (Voltages Referenced to V_SS)
Parameter
Symbol
Value
Unit
DC Supply Voltage Range
Input Voltage Range, All Inputs
DC Current Drain per Input Pin
V_DD
−0.5 to +18.0
V
V_in −0.5 to V_DD +0.5 V
I
10
mA
Power Dissipation per Package (Note 1) P_D
500
mW
Operating Temperature Range
T_A
−55 to +125
°C
Storage Temperature Range
T_stg
−65 to +150
°C
Maximum Continuous Output Drive
I_OHmax
25
mA
Current (Source) per Output
Maximum Continuous Output Power P_OHmax
50
mW
(Source) per Output (Note 2)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
2. P_OHmax = I_OH (V_DD − V_OH)
© Semiconductor Components Industries, LLC, 2006
1
June, 2006 − Rev. 6
http://onsemi.com
PDIP−18
P SUFFIX
CASE 707
1
MARKING DIAGRAM
18
MC14513BCP
AWLYYWWG
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
MC14513BCP
PDIP−18 20 Units/Rail
MC14513BCPG
PDIP−18
(Pb−Free)
20 Units/Rail
This device contains protection circuitry to protect
the inputs against damage due to high static voltages
or electric fields. However, it is advised that normal
precautions be taken to avoid application of any
voltage higher than maximum rated voltages to this
high−impedance circuit. A destructive high current
mode may occur if V_in and V_out are not constrained to
the range V_SS v (V_in or V_out) v V_DD.
Due to the sourcing capability of this circuit,
damage can occur to the device if V_DD is applied, and
the outputs are shorted to V_SS and are at a logical 1
(See Maximum Ratings).
Unused inputs must always be tied to an appropriate
logic voltage level (e.g., either V_SS or V_DD).
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Publication Order Number:
MC14513B/D