MC14069UB_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Hex Inverter

MC14069UB
Hex Inverter
The MC14069UB hex inverter is constructed with MOS P−channel
and N−channel enhancement mode devices in a single monolithic
structure. These inverters find primary use where low power
dissipation and/or high noise immunity is desired. Each of the six
inverters is a single stage to minimize propagation delays.
Features
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−Power TTL Loads or One
Low−Power Schottky TTL Load Over the Rated Temperature
Range
• Triple Diode Protection on All Inputs
• Pin−for−Pin Replacement for CD4069UB
• Meets JEDEC UB Specifications
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to V_SS)
Symbol
Parameter
Value
Unit
V_DD
V_in, V_out
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
−0.5 to +18.0
V
−0.5 to V_DD + 0.5
V
I_in, I_out Input or Output Current
(DC or Transient) per Pin
±10
mA
P_D Power Dissipation, per Package
(Note 1)
500
mW
T_A
Ambient Temperature Range
T_stg Storage Temperature Range
−55 to +125
°C
−65 to +150
°C
T_L
Lead Temperature
(8−Second Soldering)
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, V_in and V_out should be constrained
to the range V_SS ≤ (V_in or V_out) ≤ V_DD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V_SS or V_DD). Unused outputs must be left open.
http://onsemi.com
SOIC−14
D SUFFIX
CASE 751A
SOEIAJ−14
F SUFFIX
CASE 965
TSSOP−14
DT SUFFIX
CASE 948G
PIN ASSIGNMENT
IN 1 1
OUT 1 ²
IN 2 3
OUT 2 ⁴
IN 3 5
OUT 3 6
V_SS 7
14 V_DD
13 IN 6
12 OUT 6
11 IN 5
10 _{OUT 5}
9 _{IN 4}
8 _{OUT 4}
MARKING DIAGRAMS
14
14069UG
AWLYWW
1
SOIC−14
14
MC14069UB
ALYWG
1
SOEIAJ−14
14
14
069U
ALYWG
G
1
TSSOP−14
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 11
Publication Order Number:
MC14069UB/D