MC10SX1130_06 Datasheet, PDF (1/9 Pages) ON Semiconductor – LED Driver

MC10SX1130
LED Driver
Description
The MC10SX1130 is high speed LED Driver/current switch
specifically targeted for use in FDDI PMD and ANSI X3T9.3
FibreChannel 266 Mbits/s optical transmitters. The integrated circuit
contains several unique functional blocks which makes it easily
configurable for use with a variety of high performance LED devices.
The part is fabricated using MOSAIC III™ bipolar process. The logic
is designed so that a data HIGH input results in the modulation current
flowing through the I_OUT pin to turn on the LED.
The device incorporates open collector outputs with a capability of
driving peak currents of 100 mA. Since the output current switching
circuitry simply switches current between the complementary outputs,
the dynamic switching demands on the system power supply are
greatly reduced. In addition, because the design is pure bipolar, the
device current drain is insensitive to the data pattern and frequency of
operation.
The LED drive current is adjustable through the selection of an
external set resistor, RSET. In addition, to allow for open loop
compensation for the LED’s negative optical output power tracking
over temperature, a circuit is included to provide an adjustable positive
temperature tracking coefficient to the LED drive current. This is
controlled through the selection of an external resistor, RTCO.
The MC10SX1130 incorporates novel pulse stretching circuitry
which is intended to compensate for the turn-on delay and rise and fall
time asymmetry inherent in LED devices. The stretch circuitry can be
used to pre-distort the input signal pulse width to minimize the duty
cycle distortion of the transmitted optical eye pattern. The stretch
circuitry supports three different selections of pre-distortion. This
choice is accomplished through a unique ‘tri-state’ input which can be
left open, tied to V_CC, or tied to V_EE to determine the pre-distortion
amount.
The device provides a V_BB output for either single-ended use or as a
DC bias for AC coupling the signal into the device. The V_BB pin
should only be used as a bias for the MC10SX1130 as its current
sink/source capability is limited. Whenever used, the V_BB pin should
be bypassed to ground via a 0.01 mF capacitor.
http://onsemi.com
LED DRIVER
SOIC−16
D SUFFIX
CASE 751B
MARKING DIAGRAM
10SX1130G
AWLYWW
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
Features
• Differential Data Inputs
• 300 MHz Operation
• 100 mA Peak Drive Current
• Extremely Low Jitter
• Duty Cycle Distortion Compensation
• Adjustable Output Current Tracking With Temperature
• Thermally Enhanced 16-Lead SOIC Package
• 75 kW Data Input Pulldown Resistors
• +5 V or −5.2 V Operation
• V_BB Reference Available
• Pb−Free Packages are Available*
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
January, 2006 − Rev. 3
Publication Order Number:
MC10SX1130/D