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MC10H211_06 Datasheet, PDF (1/6 Pages) ON Semiconductor – Dual 3−Input 3−Output NOR Gate | |||
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MC10H211
Dual 3âInput 3âOutput NOR
Gate
Description
The MC10H211 is designed to drive up to six transmission lines
simultaneously. The multiple outputs of this device also allow the wire
ORing of several levels of gating for minimization of gate and package
count.
The ability to control three parallel lines with minimum propagation
delay from a single point makes the MC10H211 particularly useful in
clock distribution applications where minimum clock skew is desired.
Features
⢠Propagation Delay, 1.0 ns Typical
⢠Power Dissipation, 160 mW Typical
⢠Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
⢠Voltage Compensated
⢠MECL 10K⢠Compatible
⢠PbâFree Packages are Available*
2
5
3
6
4
7
12
9
13
10
14
11
VCC1 = PINS 1, 15
VCC2 = PIN 16
VEE = PIN 8
Figure 1. Logic Diagram
VCC1
1
AOUT
2
AOUT
3
AOUT
4
AIN
5
AIN
6
AIN
7
VEE
8
16
VCC2
15
VCC1
14
BOUT
13
BOUT
12
BOUT
11
BIN
10
BIN
9
BIN
Pin assignment is for DualâinâLine Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
Figure 2. Dip Pin Assignment
*For additional information on our PbâFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
November, 2006 â Rev. 9
http://onsemi.com
MARKING DIAGRAMS*
CDIPâ16
L SUFFIX
CASE 620A
16
1
PDIPâ16
P SUFFIX
CASE 648
16
MC10H211L
AWLYYWW
1
16
MC10H211P
AWLYYWWG
1
10H211
ALYWG
SOEIAJâ16
CASE 966
1 20
20 1
PLLCâ20
FN SUFFIX
CASE 775
10H211G
AWLYYWW
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G
= PbâFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC10H211/D
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