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MC10EP17_06 Datasheet, PDF (1/11 Pages) ON Semiconductor – 3.3V / 5V ECL Quad Differential Driver/Receiver
MC10EP17, MC100EP17
3.3V / 5V ECL Quad
Differential Driver/Receiver
Description
The MC10/100EP17 is a 4-bit differential line receiver based on the
EP17 device. The >3.0 GHz maximum frequency provided by the high
frequency outputs makes the device ideal for buffering of very high
speed oscillators.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The design incorporates two stages of gain, internal to the device,
making it an excellent choice for use in high bandwidth amplifier
applications.
Inputs of unused gates can be left open and will not affect the
operation of the rest of the device. All VCC and VEE pins must be
externally connected to power supply to guarantee proper operation.
The 100 Series contains temperature compensation.
Features
• 220 ps Typical Propagation Delay
• Maximum Frequency >3.0 GHz Typical
• PECL Mode Operating Range: VCC = 3.0 V to 5.5 V
with VEE = 0 V
• NECL Mode Operating Range: VCC = 0 V
with VEE = −3.0 V to −5.5 V
• Open Input Default State
• Safety Clamp on Inputs
• Q Output Will Default LOW with Inputs Open or at VEE
• VBB Output
• Pb−Free Packages are Available*
http://onsemi.com
TSSOP−20
DT SUFFIX
CASE 948E
MARKING
DIAGRAMS*
20
MCXXX
EP17
ALYWG
G
1
20
1
SO−20
DW SUFFIX
CASE 751D
20
MCXXXEP17
AWLYYWWG
1
QFN−20
MN SUFFIX
CASE 485E
20
1 XXXX
EP17
ALYWG
G
XXX
A
L,
WL
Y, YY
W, WW
G or G
= 10 or 100
= Assembly Location
= Assembly Lot
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
December, 2006 − Rev. 7
Publication Order Number:
MC10EP17/D