MC10EL32_08 Datasheet, PDF (1/9 Pages) ON Semiconductor – 5V ECL ÷2 Divider

MC10EL32, MC100EL32
5V ECL ÷2 Divider
Description
The MC10EL/100EL32 is an integrated ÷2 divider. The differential
clock inputs and the V_BB allow a differential, single-ended or AC coupled
interface to the device. The V_BB pin, an internally generated voltage
supply, is available to this device only. For single-ended input conditions,
the unused differential input is connected to V_BB as a switching reference
voltage. V_BB may also rebias AC coupled inputs. When used, decouple
V_BB and V_CC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, V_BB should be left open.
The reset pin is asynchronous and is asserted on the rising edge. Upon
power-up, the internal flip-flop will attain a random state; the reset allows
for the synchronization of multiple EL32’s in a system.
The 100 Series contains temperature compensation.
Features
• 510 ps Propagation Delay
• 3.0 GHz Toggle Frequency
• ESD Protection: > 1 kV Human Body Model,
> 100 V Machine Model
• PECL Mode Operating Range: V_CC = 4.2 V to 5.7 V with V_EE = 0 V
• NECL Mode Operating Range: V_CC = 0 V with V_EE = −4.2 V to −5.7 V
• Internal Input Pulldown Resistors on CLK(s) and R.
• Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
• Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
• Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
• Transistor Count = 82 devices
• Pb−Free Packages are Available
http://onsemi.com
8
1
SOIC−8
D SUFFIX
CASE 751
MARKING
DIAGRAMS*
8
HEL32
ALYW
G
1
8
KEL32
ALYW
G
1
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
HL32
ALYWG
G
1
8
KL32
ALYWG
G
1
DFN8
MN SUFFIX
CASE 506AA
14
14
H = MC10
L = Wafer Lot
K = MC100
Y = Year
4U = MC10
W = Work Week
2J = MC100
M = Date Code
A = Assembly Location G = Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
1
December, 2008 − Rev. 8
Publication Order Number:
MC10EL32/D