MC100EPT26_16 Datasheet, PDF (1/8 Pages) ON Semiconductor – 3.3V 1:2 Fanout Differential LVPECL/LVDS to LVTTL Translator

MC100EPT26
3.3 V 1:2 Fanout Differential
LVPECL/LVDS to LVTTL
Translator
Description
The MC100EPT26 is a 1:2 Fanout Differential LVPECL/LVDS to
LVTTL translator. Because LVPECL (Positive ECL) or LVDS levels are
used only +3.3 V and ground are required. The small outline 8-lead
package and the 1:2 fanout design of the EPT26 makes it ideal for
applications which require the low skew duplication of a signal in a
tightly packed PC board.
The V_BB output allows the EPT26 to be used in a Single-Ended
input mode. In this mode the V_BB output is tied to the D0 input for a
non-inverting buffer or the D0 input for an inverting buffer. If used,
the V_BB pin should be bypassed to ground with > 0.01ĂmF capacitor.
For a Single-Ended direct connection, use an external voltage
reference source such as a resistor divider. Do not use V_BB for a
Single-Ended direct connection or port to another device.
Features
• 1.4 ns Typical Propagation Delay
• Maximum Frequency = > 275 MHz Typical
• The 100 Series Contains Temperature Compensation
• Operating Range: V_CC = 3.0 V to 3.6 V with GND = 0 V
• 24 mA TTL outputs
• Q Outputs Will Default LOW with Inputs Open or at V_EE
• V_BB Output
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
www.onsemi.com
8
1
8
1
SOIC−8 NB
TSSOP−8
DFN8
D SUFFIX
DT SUFFIX MN SUFFIX
CASE 751−07 CASE 948R−02 CASE 506AA
MARKING DIAGRAMS*
8
KPT26
ALYW
G
1
SOIC−8 NB
8
KA26
ALYWG
G
1
TSSOP−8
1
3W MG
G
4
DFN8
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
M
= Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
Package Shipping†
MC100EPT26DG
SOIC−8 NB
(Pb-Free)
98 Units/Tube
MC100EPT26DR2G
SOIC−8 NB 2500 Tape & Reel
(Pb-Free)
MC100EPT26DTG
TSSOP−8
(Pb-Free)
100 Tape & Reel
MC100RPT26DTR2G TSSOP−8
(Pb-Free)
2500 Tape & Reel
MC100EPT26MNR4G DFN8
(Pb-Free)
1000 Tape & Reel
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
August, 2016 − Rev. 17
Publication Order Number:
MC100EPT26/D