MC100EP14_06 Datasheet, PDF (1/9 Pages) ON Semiconductor – 3.3V / 5V 1:5 Differential ECL/PECL/HSTL Clock Driver

MC100EP14
3.3V / 5V 1:5 Differential
ECL/PECL/HSTL Clock Driver
Description
The MC100EP14 is a low skew 1−to−5 differential driver, designed with
clock distribution in mind, accepting two clock sources into an input
multiplexer. The ECL/PECL input signals can be either differential or
single−ended (if the V_BB output is used). HSTL inputs can be used when
the LVEP14 is operating under PECL conditions.
The EP14 specifically guarantees low output−to−output skew. Optimal
design, layout, and processing minimize skew within a device and from
device to device.
To ensure that the tight skew specification is realized, both sides of
any differential output need to be terminated even if only one output is
being used. If an output pair is unused, both outputs may be left open
(unterminated) without affecting skew.
The common enable (EN) is synchronous, outputs are enabled/
disabled in the LOW state. This avoids a runt clock pulse when the
device is enabled/disabled as can happen with an asynchronous
control. The internal flip flop is clocked on the falling edge of the input
clock, therefore all associated specification limits are referenced to the
negative edge of the clock input.
The MC100EP14, as with most other ECL devices, can be operated
from a positive V_CC supply in PECL mode. This allows the EP14 to be
used for high performance clock distribution in 5.0 V systems.
Designers can take advantage of the EP14’s performance to distribute
low skew clocks across the backplane or the board.
Features
• 400 ps Typical Propagation Delay
• 100 ps Device−to−Device Skew
• 25 ps Within Device Skew
• Maximum Frequency > 2 GHz Typical
• The 100 Series Contains Temperature Compensation
• PECL and HSTL Mode:
V_CC = 3.0 V to 5.5 V with V_EE = 0 V
• NECL Mode:
V_CC = 0 V with V_EE = −3.0 V to −5.5 V
• Open Input Default State
• These are Pb−Free Devices
http://onsemi.com
TSSOP−20
DT SUFFIX
CASE 948E
MARKING DIAGRAM*
20
100
EP14
ALYWG
G
1
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
November, 2006 − Rev. 5
Publication Order Number:
MC100EP14/D