MBRS140LT3G Datasheet, PDF (1/5 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier

MBRS140LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE − 40 VOLTS
Mechanical Characteristics:
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (Approximately)
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MAXIMUM RATINGS
Rating
Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
40
V
V_RWM
V_R
Average Rectified Forward Current
(At Rated V_R, T_C = 110°C)
I_O
1.0
A
Peak Repetitive Forward Current (At Rated I_FRM
2.0
A
V_R, Square Wave, 100 kHz, T_C = 110°C)
Non−Repetitive Peak Surge Current
I_FSM
40
A
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Storage / Operating Case Temperature
T_stg, T_C −55 to +150 °C
Operating Junction Temperature
T_J −55 to +125 °C
Voltage Rate of Change
(Rated V_R, T_J = 25°C)
dv/dt
10,000 V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
B14LG
G
B14L = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
MBRS140LT3
SMB
2500/Tape & Reel
MBRS140LT3G
SMB
2500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2007
1
October, 2007 − Rev. 3
Publication Order Number:
MBRS140LT3/D