MBR830MFS Datasheet, PDF (1/4 Pages) ON Semiconductor – SWITCHMODE Power Rectifiers

MBR830MFS, NRVB830MFS
SWITCHMODE
Power Rectifiers
These state−of−the−art devices have the following features:
Features
• Low Power Loss / High Efficiency
• New Package Provides Capability of Inspection and Probe After
Board Mounting
• Guardring for Stress Protection
• Low Forward Voltage
• 150°C Operating Junction Temperature
• Wettable Flacks Option Available
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These are Pb−Free and Halide−Free Devices
Mechanical Characteristics:
• Case: Epoxy, Molded
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
V_RRM
V
Working Peak Reverse Voltage
V_RWM
DC Blocking Voltage
V_R
30
Average Rectified Forward Current
I_F(AV)
8.0
A
(Rated V_R, T_C = 143°C)
Peak Repetitive Forward Current,
I_FRM
16
A
(Rated V_R, Square Wave,
20 kHz, T_C = 143°C)
Non−Repetitive Peak Surge Current
I_FSM
150
A
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
Storage Temperature Range
Operating Junction Temperature
Unclamped Inductive Switching
Energy (10 mH Inductor,
Non−repetitive)
T_stg
−65 to +150 °C
T_J
−40 to +150 °C
E_AS
100
mJ
ESD Rating (Human Body Model)
3B
ESD Rating (Machine Model)
M4
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NOTE: The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RJA.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
8 AMPERES
30 VOLTS
1,2,3
5,6
MARKING
DIAGRAM
A
C
1
A
B830
SO−8 FLAT LEAD
A ^AYWZZ
CASE 488AA
Not Used
C
STYLE 2
B830
A
Y
W
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
ORDERING INFORMATION
Device
Package
MBR830MFST1G SO−8 FL
(Pb−Free)
MBR830MFST3G
NRVB830MFST1G
SO−8 FL
(Pb−Free)
SO−8 FL
(Pb−Free)
NRVB830MFST3G SO−8 FL
(Pb−Free)
Shipping†
1500 /
Tape & Reel
5000 /
Tape & Reel
1500 /
Tape & Reel
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
October, 2013 − Rev. 0
Publication Order Number:
MBR830MFS/D