MBR350_06 Datasheet, PDF (1/4 Pages) ON Semiconductor – Axial Lead Rectifiers

MBR350, MBR360
MBR360 is a Preferred Device
Axial Lead Rectifiers
These devices employ the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low−voltage,
high−frequency inverters, free wheeling diodes, and polarity
protection diodes.
Features
• Extremely Low v_F
• Low Power Loss/High Efficiency
• Highly Stable Oxide Passivated Junction
• Low Stored Charge, Majority Carrier Conduction
• Pb−Free Packages are Available*
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Cathode indicated by Polarity Band
MAXIMUM RATINGS
Rating
Symbol Max Unit
Peak Repetitive Reverse Voltage
V_RRM
V
Working Peak Reverse Voltage
V_RWM
DC Blocking Voltage
MBR350
MBR360
V_R
50
60
Average Rectified Forward Current T_A = 65°C
(R_qJA = 28°C/W, P.C. Board Mounting)
I_O
3.0
A
Non−Repetitive Peak Surge Current (Note 1)
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz, T_L = 75°C)
I_FSM
80
A
Operating and Storage Junction Temperature
Range (Reverse Voltage Applied)
T_J, T_stg −65 to °C
+150
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Ambient
R_qJA
(see Note 4 − Mounting Data, Mounting Method 3)
28 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Lead Temperature reference is cathode lead 1/32 in from case.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES
50, 60 VOLTS
AXIAL LEAD
CASE 267−05
(DO−201AD)
STYLE 1
MARKING DIAGRAM
A
MBR
3x0G
G
A
= Assembly Location
x
= 5 or 6
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
June, 2006 − Rev. 6
Publication Order Number:
MBR350/D