MBD770DWT1G Datasheet, PDF (1/4 Pages) ON Semiconductor – Schottky Barrier Diodes

MBD770DWT1G,
NSVMBD770DWT1G
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
• Extremely Fast Switching Speed
• Low Forward Voltage
• AEC Qualified and PPAP Capable
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS (T_J = 150°C unless otherwise noted)
Rating
Symbol
Value
Unit
Forward Current
I_F
100
mA
Non−Repetitive Peak Forward Surge
I_FSM
1
A
Current (60 Hz Half Sine)
Reverse Voltage
Forward Power Dissipation
@ T_A = 25°C
Derate above 25°C (Note 1)
V_R
70
V
P_F
380
mW
3
mW/°C
Operating Junction and Storage
Temperature Range
T_J, T_stg − 55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR4 @ 100 mm², 1 oz Cu
http://onsemi.com
70 VOLTS SCHOTTKY
BARRIER DIODES
Anode 1
N/C 2
Cathode 3
6 Cathode
5 N/C
4 Anode
MARKING
DIAGRAM
6
SOT−363
CASE 419B
1
STYLE 6
H5 MG
G
1
M
= Date Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping^†
MBD770DWT1G
SOT−363
3000 /
(Pb−Free) Tape & Reel
NSVMBD770DWT1G SOT−363
3000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
1
October, 2012 − Rev. 1
Publication Order Number:
MBD770DW/D