MBD301G_16 Datasheet, PDF (1/5 Pages) ON Semiconductor – Silicon Hot-Carrier Diodes

MBD301G,
MMBD301LT1G,
MMBD301LT3G,
SMMBD301LT3G
Silicon Hot-Carrier Diodes
Schottky Barrier Diodes
These devices are designed primarily for high−efficiency UHF and
VHF detector applications. They are readily adaptable to many other
fast switching RF and digital applications. They are supplied in an
inexpensive plastic package for low−cost, high−volume consumer
and industrial/commercial requirements. They are also available in a
Surface Mount package.
Features
• Extremely Low Minority Carrier Lifetime − 15 ps (Typ)
• Very Low Capacitance − 1.5 pF (Max) @ V_R = 15 V
• Low Reverse Leakage − I_R = 13 nAdc (Typ) MBD301, MMBD301
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
Total Device Dissipation
@ T_A = 25°C
MBD301G
MMBD301LT1G, MMBD301LT3G,
SMMBD301LT3G
Symbol Value Unit
V_R
30
V
I_F 200 (Max) mA
P_F
MW
280
200
Derate above 25°C
MBD301G
MMBD301LT1G, MMBD301LT3G,
SMMBD301LT3G
mW/°C
2.8
2.0
Operating Junction
Temperature Range
T_J
−55 to
°C
+125
Storage Temperature Range
T_stg
−55 to
°C
+150
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
30 VOLTS
SILICON HOT−CARRIER
DETECTOR AND SWITCHING
DIODES
TO−92 2−Lead
CASE 182
STYLE 1
SOT−23 (TO−236)
CASE 318
STYLE 8
TO−92
SOT−23
2
CATHODE
1
3
ANODE CATHODE
1
ANODE
MARKING DIAGRAMS
MBD
301
AYW G
G
4T M G
G
1
TO−92
SOT−23
A = Assembly Location
Y = Year
W = Work Week
4T = Device Code (SOT−23)
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 1994
1
October, 2016 − Rev. 8
Publication Order Number:
MBD301/D