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MBD110DWT1G_12 Datasheet, PDF (1/6 Pages) ON Semiconductor – Dual Schottky Barrier Diodes | |||
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MBD110DWT1G,
MBD330DWT1G,
MBD770DWT1G
Dual Schottky Barrier
Diodes
Application circuit designs are moving toward the consolidation of
device count and into smaller packages. The new SOTâ363 package is a
solution which simplifies circuit design, reduces device count, and reduces
board space by putting two discrete devices in one small sixâleaded
package. The SOTâ363 is ideal for lowâpower surface mount applications
where board space is at a premium, such as portable products.
Surface Mount Comparisons:
Area (mm2)
Max Package PD (mW)
Device Count
SOTâ363
4.6
120
2
SOTâ23
7.6
225
1
Space Savings:
Package
SOTâ363
1 x SOTâ23
40%
2 x SOTâ23
70%
The MBD110DW, MBD330DW, and MBD770DW devices are
spinâoffs of our popular MMBD101LT1, MMBD301LT1, and
MMBD701LT1 SOTâ23 devices. They are designed for highâefficiency
UHF and VHF detector applications. Readily available to many other fast
switching RF and digital applications.
Features
⢠Extremely Low Minority Carrier Lifetime
⢠Very Low Capacitance
⢠Low Reverse Leakage
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
MBD110DWT1G
VR
MBD330DWT1G
MBD770DWT1G
7.0
V
30
70
Forward Current (DC) MBD330DWT1G
IF
200 Max mA
Forward Power Dissipation TA = 25°C
PF
120
mW
Junction Temperature
TJ
â55 to +125 °C
Storage Temperature Range
Tstg
â55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
Anode 1
N/C 2
Cathode 3
6 Cathode
5 N/C
4 Anode
1
SCâ88 / SOTâ363
CASE 419B
STYLE 6
MARKING DIAGRAM
6
xx M G
G
1
xx = Device Code
Refer to Ordering Table,
page 2
M = Date Code
G = PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
September, 2011 â Rev. 7
Publication Order Number:
MBD110DWT1/D
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