LMV931_12 Datasheet, PDF (1/18 Pages) ON Semiconductor – Single and Dual LowVoltage, Rail-to-Rail Input and Output,Operational Amplifiers

LMV931, LMV932
Single and Dual Low
Voltage, Rail-to-Rail Input
and Output, Operational
Amplifiers
The LMV931 Single and LMV932 Dual are CMOS low−voltage
operational amplifiers which can operate on single−sided power
supplies (1.8 V to 5.0 V) with rail−to−rail input and output swing.
Both devices come in small state−of−the−art packages and require
very low quiescent current making them ideal for battery−operated,
portable applications such as notebook computers and hand−held
instruments. Rail−to−Rail operation provides improved signal−to−noise
performance plus the small packages allow for closer placement to
signal sources thereby reducing noise pickup.
The single LMV931 is offered in space saving SC70−5 package.
The dual LMV932 is in either a Micro8 or SOIC package. These small
packages are very beneficial for crowded PCB’s.
Features
• Performance Specified on Single−Sided Power Supply: 1.8 V, 2.7 V, and
5V
• Small Packages:
LMV931 in a SC−70
LMV932 in a Micro8 or SOIC−8
• No Output Crossover Distortion
• Extended Industrial Temperature Range: −40°C to +125°C
• Low Quiescent Current 210 mA, Max Per Channel
• No Output Phase−Reversal from Overdriven Input
• These are Pb−Free Devices
Typical Applications
• Notebook Computers, Portable Battery−Operated Instruments, PDA’s
• Active Filters, Low−Side Current Monitoring
0.1
R_L = 600 W
0.09
T_A = 25°C
0.08
0.07
0.06
0.05
0.04
0.03
V_OH
0.02
0.01
V_OL
01.8 _{2.2 2.6 3}
3.4 3.8 4.2 4.6 5
SUPPLY VOLTAGE (mV)
Figure 1. Output Voltage Swing vs. Supply Voltage
http://onsemi.com
MARKING
DIAGRAMS
LMV931 (Single)
SC−70
CASE 419A
AAF MG
G
5
1
TSOP−5
CASE 483
5
ADF MG
G
1
M = Date Code
G = Pb−Free Package
(*Note: Microdot may be in either location)
LMV932 (Dual)
8
Micro8]
CASE 846A
V932
AYWG
G
1
8
1
SOIC−8
CASE 751
8
LMV932
ALYW
G
1
A
= Assembly Location
Y
= Year
L
= Wafer Lot
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
August, 2012 − Rev. 9
Publication Order Number:
LMV931/D