LLGA12 Datasheet, PDF (1/2 Pages) ON Semiconductor – CASE 513AD−01 ISSUE A

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 4:1
LLGA12
CASE 513AD−01
ISSUE A
D
AB
PIN ONE
REFERENCE
2X
0.15 C
ÎÎÎÎÎÎÎÎÎ
2X
0.15 C
TOP VIEW
0.10 C
12X
0.08 C
A1
SIDE VIEW
E
A
C
SEATING
PLANE
D2
e
1
6
12X K
E2
12X L
12
7 12X
b
BOTTOM VIEW
0.10 C A B
0.05 C NOTE 3
DATE 22 FEB 2007
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.50 0.60
A1 0.00 0.05
b 0.20 0.30
D
3.00 BSC
D2 2.75 2.85
E
3.00 BSC
E2 1.65 1.75
e
0.50 BSC
K 0.20 −−−
L 0.35 0.45
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to de-
vice data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
3.30
1
12X
0.56
0.40
0.25
PITCH
2.78
11X
0.28
1.73
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON22277D
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, 2D0E0S2 C− ReIPv.T0ION: 12 PIN LLGA, 3 X 3 X 0.5P, 0.55₁T
Case Outline Number:
PAGE 1 OFX2XX