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KAI-16000_16 Datasheet, PDF (1/28 Pages) ON Semiconductor – Interline CCD Image Sensor | |||
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KAI-16000
4872 (H) x 3248 (V)
Interline CCD Image Sensor
Description
The KAIâ16000 is an interline transfer CCD offering 16 million
pixels at up to 3 frames per second through 2 outputs. This image
sensor is organized into an array of 4,872 (H) x 3,248 (V) with
7.4 micron square pixels and full 35 mm optical format. As an
interline transfer CCD, the KAIâ16000 includes additional features
such as progressive scan readout, electronic shutter, low noise, high
dynamic range, and blooming suppression. These features make the
KAIâ16000 the perfect sensor for applications in Industrial, Aerial,
Security, and Scientific markets.
Table 1. GENERAL SPECIFICATIONS
Parameter
Typical Value
Architecture
Interline CCD; Progressive Scan
Total Number of Pixels
4960 (H) x 3324 (V) = 16.6M
Number of Effective Pixels
4904 (H) x 3280 (V) = 16.1M
Number of Active Pixels
4872 (H) x 3248 (V) = 15.8M
Pixel Size
7.4 mm (H) x 7.4 mm (V)
Active Image Size
36.1 mm (H) x 24.0 mm (V)
43.3 mm (diagonal),
35 mm Optical Format
Aspect Ratio
3:2
Number of Outputs
1 or 2
Saturation Signal
Output Sensitivity
30,000 electrons
30 mV/eâ
Quantum Efficiency
KAIâ16000âAXA
KAIâ16000âCXA (RGB)
KAIâ16000âFXA (RGB)
47%
29%, 38%, 44%
31%, 39%, 45%
Read Noise (f = 30 MHz)
Dark Current
16 electrons
< 0.5 nA/cm2
Dark Current Doubling Temperature
7°C
Dynamic Range
65 dB
Charge Transfer Efficiency
0.99999
Blooming Suppression
> 100 X
Smear
< â80 dB
Image Lag
< 10 electrons
Maximum Data Rate
30 MHz per channel
Package
40 pin Grid Array
Cover Glass
AR coated, 2 sides
or Clear Glass
NOTE: All parameters are specified at T = 40°C unless otherwise noted.
www.onsemi.com
Figure 1. KAIâ16000 CCD Image Sensor
Features
⢠16 Million Pixel Resolution
⢠Electronic Shutter
⢠35 mm Optical Format
⢠Progressive Scan Readout
⢠High Sensitivity
⢠Fast Frame Rate
⢠> 60 dB Dynamic Range
Applications
⢠Industrial
⢠Aerial Photography
⢠Security
⢠Scientific
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
February, 2016 â Rev. 6
Publication Order Number:
KAIâ16000/D
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