KAI-11002 Datasheet, PDF (1/33 Pages) ON Semiconductor – Interline CCD Image Sensor

KAI-11002
4008 (H) x 2672 (V) Interline
CCD Image Sensor
Description
The KAI−11002 Image Sensor is a high-performance 11-million
pixel sensor designed for professional digital still camera applications.
The 9.0 mm square pixels with microlenses provide high sensitivity
and the large full well capacity results in high dynamic range. The two
high-speed outputs and binning capabilities allow for 1−3 frames per
second (fps) video rate for the progressively scanned images.
The vertical overflow drain structure provides anti-blooming
protection and enables electronic shuttering for precise exposure
control. Other features include low dark current, negligible lag and
low smear.
Table 1. GENERAL SPECIFICATIONS
Parameter
Typical Value
Architecture
Interline CCD, Progressive Scan
Total Number of Pixels
Number of Effective Pixels
Number of Active Pixels
4072 (H) × 2720 (V) = 11.1 M
4033 (H) × 2688 (V) = 10.8 M
4008 (H) × 2672 (V) = 10.7 M
Number of Outputs
Pixel Size
Active Image Size
1 or 2
9.0 mm (H) × 9.0 mm (V)
37.25 mm (H) × 25.70 mm (V),
43.3 mm (Diagonal),
35 mm Optical Format
Aspect Ratio
Saturation Signal
Quantum Efficiency
KAI−11002−ABA
KAI−11002−CBA (RGB)
KAI−11002−FBA (RGB)
Output Sensitivity
Total Noise
3:2
60,000 e^−
50%
32%, 34%, 40%
35%, 38%, 40%
13 mV/e^−
30 e^−
Dark Current
Dark Current Doubling
Temperature
< 50 mV/s
7°C
Dynamic Range
66 dB
Charge Transfer Efficiency
Blooming Suppression
> 0.99999
> 1000X
Smear
Image Lag
< −80 dB
< 10 e^−
Maximum Data Rate
28 MHz
Package
40-pin, CERDIP, 0.070″ Pin Spacing
Cover Glass
AR Coated
NOTE: All Parameters are specified at T = 40°C unless otherwise noted.
www.onsemi.com
Figure 1. KAI−11002 Interline CCD
Image Sensor
Features
• High Resolution
• High Sensitivity
• High Dynamic Range
• Low Noise Architecture
• High Frame Rate
• Binning Capability for Higher Frame Rate
• Electronic Shutter
Applications
• Industrial Inspection
• Aerial Photography
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
September, 2015 − Rev. 4
Publication Order Number:
KAI−11002/D