GB3225 Datasheet, PDF (1/7 Pages) ON Semiconductor – Preconfigured DSP System

PARAGON GB3225
Preconfigured DSP System
for Hearing Aids
Description
The Paragon GB3225 hybrid is a programmable DSP system based
on a multi−channel compression circuit. It can be used as a platform
for a wide range of hearing aid applications. Its extensive
programmability and compact size make it ideal for sophisticated CIC
applications. The reflowable thinSTAX^® packaging enables easy
integration into BTE applications. This very versatile DSP hybrid is
capable of multiple configurations and has a wide range of functions.
The Paragon GB3225 hybrid contains the GC5057 controller chip
featuring Power On Reset (POR).
The Paragon GB3225 hybrid code programmed into the GC5057
controller chip is “9”.
Features
• Highly Configurable, Versatile DSP Platform
• High Fidelity, Multi−channel AGC Signal Processing
• 93 dB Input Dynamic Range with HRXt Headroom Extension
• Fully Programmable via Serial Data Interface
• High Performance Data Converters – Dual, Over−sampled A/Ds;
Over−sampled D/A with Efficient Switched−mode Output Power Amp
• High−fidelity Audio Quality
• Drives Zero−bias 2−terminal Receivers
• Multiple Communication Rates up to 85.3 kb/s
• thinSTAX Packaging − CIC Size
• Multi−memory
• Internal/External Volume Control
• Volume Control Taper determined by External VC
• Tri−state Memory Select Operation
• Audible Memory Change Indicator
• Also Available as E1 RoHS Compliant Hybrid
thinSTAX Packaging
• Hybrid Typical Dimensions:
0.227 x 0.125 x 0.060 in
(5.76 x 3.18 x 1.52 mm)
http://onsemi.com
14 PAD
PARAGON
CASE TBD
PAD CONNECTION
RREG 7
RMIC 6
RGND 5
VC 4
SDA 3
PGND 2
OUT− 1
8 FREG
9 FMIC
10 FGND
11 T
12 MS
13 VB
14 OUT+
(Bottom View)
MARKING DIAGRAM
GB3225−E1
XXXXXX
GB3225
E1
XXXXXX
= Specific Device Code
= RoHS Compliant Hybrid
= Work Order Number
ORDERING INFORMATION
Device
Shipping^†
GB3225−E1
25 Units / Bubble Pack
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
February, 2014 − Rev. 2
Publication Order Number:
GB3225/D