GB3221 Datasheet, PDF (1/8 Pages) ON Semiconductor – Preconfigured DSP System

PARAGON GB3221
Preconfigured DSP System
for Hearing Aids
Description
The Paragon GB3221 hybrid is a programmable DSP system based
on a multi−channel compression circuit. This hybrid is designed for
low impedance receivers. It can be used as a platform for a wide range
of hearing aid applications. It also offers a separate supply line to the
A/D and H−Bridge circuits. The reflowable thinSTAX^® packaging
enables easy integration into BTE applications. This versatile DSP
hybrid is capable of multiple configurations and has a wide range of
functions.
The Paragon GB3221 hybrid contains the GC5057 controller
featuring Power On Reset (POR) behavior.
The Paragon GB3221 hybrid code programmed into the GC5051
and the GC5057 controller chip is “7”.
Features
• High Power Applications
• Highly Configurable, Versatile DSP Platform
• High Fidelity, Multi−channel AGC Signal Processing
• 93 dB Input Dynamic Range with HRXt Headroom Extension
• Fully Programmable via Serial Data Interface
• High Performance Data Converters – Dual, Over−sampled A/Ds;
Over−sampled D/A with Efficient Switched−mode Output Power Amp
• High−fidelity Audio Quality
• Drives Zero−bias 2−terminal Receivers
• Multiple Communication Rates up to 85.3 kb/s
• Multi−memory
• Internal/External Volume Control
• Volume Control Taper determined by External VC
• Two Memory Select Pads
• Tri−state Memory Select Operation
• Audible Memory Change Indicator
• Also Available as E1 RoHS Compliant Hybrid
thinSTAX Packaging
• Hybrid Typical Dimensions:
0.227 x 0.125 x 0.060 in
(5.76 x 3.18 x 1.52 mm)
http://onsemi.com
15 PAD
PARAGON
CASE TBD
PAD CONNECTION
VREG
7
8
MGND
RMIC
6
9
FMIC
VC 5
10 T
SDA
4
11 MS
GND
3
12 VB
PGND
2
13 MS2
1
15
14
OUT− OUT+ VBP
(Bottom View)
MARKING DIAGRAM
GB3221−E1
XXXXXX
GB3221
E1
XXXXXX
= Specific Device Code
= RoHS Compliant Hybrid
= Work Order Number
ORDERING INFORMATION
Device
Shipping^†
GB3221−E1
25 Units / Bubble Pack
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
February, 2014 − Rev. 2
Publication Order Number:
GB3221/D