ESD8008 Datasheet, PDF (1/9 Pages) ON Semiconductor – ESD Protection Diode

ESD8008
ESD Protection Diode
Low Capacitance Array for High Speed
Data Lines
The ESD8008 is designed specifically to protect four high speed
differential pairs. Ultra−low capacitance and low ESD clamping
voltage make this device an ideal solution for protecting voltage
sensitive high speed data lines. The flow−through style package
allows for easy PCB layout and matched trace lengths necessary to
maintain consistent impedance for the high speed lines.
Features
• Integrated 4 Pairs (8 Lines) High Speed Data
• Single Connect, Flow through Routing
• Low Capacitance (0.35 pF Max, I/O to GND)
• Protection for the Following IEC Standards:
IEC 61000−4−2 Level 4 (ESD) ±15 kV (Contact)
IEC 61000−4−5 (Lightning) 5 A (8/20 ms)
• UL Flammability Rating of 94 V−0
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• V−by−One HS
• LVDS
• Display Port
www.onsemi.com
14
1
UDFN14
CASE 517CN
MARKING
DIAGRAM
8008M
G
8008
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
ESD8008MUTAG
UDFN14 3000 / Tape &
(Pb−Free)
Reel
SZESD8008MUTAG UDFN14 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range
T_J
−55 to +125 °C
Storage Temperature Range
T_stg
−55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
T_L
260
°C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±15
kV
±15
kV
Maximum Peak Pulse Current
8/20 ms @ T_A = 25°C (I/O−GND)
I_PP
5.0
A
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2015
1
February, 2015 − Rev. 4
Publication Order Number:
ESD8008/D