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| EMX2DXV6T5 Datasheet, PDF (1/4 Pages) ON Semiconductor – Dual NPN General Purpose Amplifier Transistor | |||
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EMX2DXV6T5
Preferred Devices
Dual NPN General Purpose
Amplifier Transistor
This NPN transistor is designed for general purpose amplifier
applications. This device is housed in the SOT-563 package which is
designed for low power surface mount applications, where board
space is at a premium.
Features
⢠Reduces Board Space
⢠High hFE, 210â460 (Typical)
⢠Low VCE(sat), < 0.5 V
⢠These are PbâFree Devices
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
Collector-Base Voltage
V(BR)CBO
60
Collector-Emitter Voltage
V(BR)CEO
50
Emitter-Base Voltage
V(BR)EBO
7.0
Collector Current â Continuous
IC
100
Vdc
Vdc
Vdc
mAdc
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD
357 (Note 1)
mW
2.9 (Note 1) mW/°C
Thermal Resistance,
Junction-to-Ambient
RqJA
350 (Note 1)
°C/W
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD
500 (Note 1)
mW
4.0 (Note 1) mW/°C
Thermal Resistance,
Junction-to-Ambient
RqJA
250 (Note 1)
°C/W
Junction and Storage
Temperature Range
TJ, Tstg â55 to +150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FRâ4 @ Minimum Pad
http://onsemi.com
DUAL NPN GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
(3)
(2)
(1)
Q2
Q1
(4) (5)
(6)
MARKING
DIAGRAM
6
1
SOTâ563
CASE 463A
STYLE 2
3R M G
G
1
3R = Specific Device Code
M = Month Code
G = PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
EMX2DXV6T5
SOTâ563 8000/Tape & Reel
(PbâFree)
EMX2DXV6T5G SOTâ563 8000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
1
November, 2005 â Rev. 2
Publication Order Number:
EMX2DXV6T5/D
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