DF6A6.8FUT1_05 Datasheet, PDF (1/4 Pages) ON Semiconductor – Quad Array for ESD Protection

DF6A6.8FUT1
Quad Array for
ESD Protection
This quad voltage suppressor is designed for applications requiring
transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its quad junction common anode design protects
four separate lines using only one package. These devices are ideal for
situations where board space is at a premium.
Specification Features
• SC−88 Package Allows Four Separate Unidirectional Configurations
• Low Leakage < 1 mA @ 5 Volt
• Breakdown Voltage: 6.4 − 7.2 Volt @ 5 mA
• Low Capacitance (40 pF typical)
• ESD Protection Meeting 61000−4−2 Level 4
and 16 kV Human Body Model
• Pb−Free Package is Available
Mechanical Characteristics
• Void Free, Transfer−Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
MAXIMUM RATINGS (T_A = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Peak Power Dissipation @ 8 x 20 ms
P_pk
(Note 1)
75
Watts
Steady State Power Dissipation
(Note 2)
P_D
385
mW
Thermal Resistance −
Junction−to−Ambient
Derate Above 25°C
R_qJA
328
°C/W
3.0
mW/°C
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
T_Jmax
150
°C
T_J, T_stg
−55 to
°C
+150
ESD Discharge
V_PP
kV
MIL STD 883C − Method 3015−6
16
IEC61000−4−2, Air Discharge
16
IEC61000−4−2, Contact Discharge
8
Lead Solder Temperature
(10 seconds duration)
T_L
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Per Waveform Figure 1
2. Mounted on FR−5 Board = 1.0 X 0.75 X 0.062 in.
http://onsemi.com
1
6
2
5
3
4
MARKING
DIAGRAM
SC−88
CASE 419B−02
6
68 ^M G
G
1
68 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location.)
ORDERING INFORMATION
Device
Package
Shipping^†
DF6A6.8FUT1
SC−88 3000/Tape & Reel
DF6A6.8FUT1G
SC−88
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
1
June, 2005 − Rev. 1
Publication Order Number:
DF6A6.8FUT1/D