CS5301_06 Datasheet, PDF (1/19 Pages) ON Semiconductor – Three−Phase Buck Controller with Integrated Gate Drivers and Power Good

CS5301
Three−Phase
Buck Controller with
Integrated Gate Drivers and
Power Good
The CS5301 is a three−phase step down controller which
incorporates all control functions required to power high performance
processors and high current power supplies. Proprietary multi−phase
architecture guarantees balanced load current distribution and reduces
overall solution cost in high current applications. Enhanced V²t
control architecture provides the fastest possible transient response,
excellent overall regulation, and ease of use.
The CS5301 multi−phase architecture reduces output voltage and
input current ripple, allowing for a significant reduction in inductor
values and a corresponding increase in inductor current slew rate. This
approach allows a considerable reduction in input and output capacitor
requirements, as well as reducing overall solution size and cost.
Features
• Enhanced V² Control Method
• 5−Bit DAC with 1% Accuracy
• Adjustable Output Voltage Positioning
• 6 On−Board Gate Drivers
• 200 kHz to 800 kHz Operation Set by Resistor
• Current Sensed through Buck Inductors, Sense Resistors, or V−S
Control
• Hiccup Mode Current Limit
• Individual Current Limits for Each Phase
• On−Board Current Sense Amplifiers
• 3.3 V, 1.0 mA Reference Output
• 5.0 V and/or 12 V Operation
• On/Off Control (through COMP Pin)
• Power Good Output
• Pb−Free Package is Available*
http://onsemi.com
MARKING DIAGRAM
32
SO−32WB
CASE 751P
DW SUFFIX
1
CS5301
AWLYYWWG
32
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
PIN CONNECTIONS
1
COMP
V_FB
V_DRP
CS1
CS2
CS3
CS_REF
PWRGD
V_ID0
V_ID1
V_ID2
V_ID3
V_ID4
PWRGDS
I_LIM
REF
32
R_OSC
V_CCL
V_CCL1
GATE(L)1
GND1
Gate(H)1
V_CCH12
Gate(H)2
GND2
Gate(L)2
V_CCL23
Gate(L)3
GND3
Gate(H)3
V_CCH3
LGND
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
February, 2006 − Rev. 12
ORDERING INFORMATION
Device
Package Shipping^†
CS5301GDW32
SO−32 22 Units/Rail
CS5301GDWR32 SO−32 1000 Tape & Reel
CS5301GDWR32G SO−32 1000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
CS5301/D