CM1624_13 Datasheet, PDF (1/7 Pages) ON Semiconductor – EMI Filter for T-Flash / MicroSD Interfaces

CM1624
EMI Filter for T-Flash /
MicroSD Interfaces
Description
The CM1624 is a combination EMI filter and line termination
device with integrated TVS diodes for use on Multimedia Card
interfaces. This state−of−the−art device utilizes solid−state, silicon−
avalanche technology for superior clamping performance and DC
electrical characteristics. The CM1624 has been optimized for
protection of T−Flash/MicroSD interfaces in cellular phones and other
portable electronics.
The CM1624 consists of six circuits that includes series impedance
matching resistors and pull−up resistors as required by the SD
specification. TVS diodes are included on each line for ESD
protection. An additional TVS diode connection is included for
protection of the voltage (Vcc) bus. Termination resistor value of 40 W
is provided on the SDData0, SDData1, SDData2, SDData3, CMD, and
CLK lines.
Pull−up resistors of 25 kW are included on the SDData0, SDData1,
SDData2, SDData3 and CMD lines, as well. These may be configured
for devices operating in SD or SPI mode. The TVS diodes provide
effective suppression of ESD voltages in excess of ±15 kV (contact
discharge) per IEC 61000−4−2, level 4. The CM1624 is in a 16−pin,
RoHS/WEEE compliant, UDFN 16−pin package. It measures 3.30 x
1.35 x 0.50 mm. The leads are spaced at a pitch of 0.4 mm and are
finished with lead−free NiPd.
Features
• Bidirectional EMI/RFI Filtering and Line Termination with
Integrated ESD Protection
• Provides ESD Protection to IEC61000−4−2:
±15 kV Contact Discharge
• TVS Working Voltage: 5 V
• Termination Resistors: 40 W
• Pull−up Resistors: 25 kW
• Typical Capacitance per Line: 12 pF (V_IN = 2.5 V)
• Protection and Termination for Six Lines + Vcc
• Solid−state Technology
Applications
• T−Flash / MicroSD Interfaces
• MMC Interfaces
• CDMA, GSM, 3G Cell Phones
Mechanical Characteristics
• 0.40 mm, uDFN 16−pin Package
• Nominal Dimensions: 3.30 x 1.35 x 0.50 mm
• Pitch: 0.4 mm
• Pin−lead Finish: NiPd
• RoHS/WEEE Compliance, Lead−free Finish
http://onsemi.com
16
1
UDFN16
DE SUFFIX
CASE 517BE
MARKING DIAGRAM
1624 MG
G
1
1624
M
G
= Specific Device Code
= Single Character Date Code
= Pb−Free Package
(*Note: Microdot may be in either location)
PINOUT DIAGRAM
SDData1
SDData0
SDCLK
ESD1
ESD3
SDCMD
SDData3
SDData2
Data1
Data0
CLK
ESD1
VCC
CMD
Data3
Data2
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
CM1624−08DE UDFN16 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
April, 2013 − Rev. 3
Publication Order Number:
CM1624/D