BZX84C3V3ET1G Datasheet, PDF (1/6 Pages) ON Semiconductor – Zener Voltage Regulators

BZX84CxxxET1G Series,
SZBZX84CxxxET1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
 225 mW Rating on FR−4 or FR−5 Board
 Zener Breakdown Voltage Range − 2.4 V to 75 V
 Package Designed for Optimal Automated Board Assembly
 Small Package Size for High Density Applications
 ESD Rating of Class 3 (> 16 kV) per Human Body Model
 Peak Power − 225 W (8 X 20 ms)
 AEC−Q101 Qualified and PPAP Capable
 SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
 Pb−Free Packages are Available*
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol Max Unit
Peak Power Dissipation @ 20 ms (Note 1)
@ T_L  25C
Total Power Dissipation on FR−5 Board,
(Note 2) @ T_A = 25C
Derated above 25C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 3) @ T_A = 25C
Derated above 25C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
P_pk
225
W
P_D
R_qJA
P_D
R_qJA
T_J, T_stg
225
1.8
556
300
2.4
417
−65 to
+150
mW
mW/C
C/W
mW
mW/C
C/W
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
1
January, 2012 − Rev. 8
http://onsemi.com
SOT−23
CASE 318
STYLE 8
3
Cathode
1
Anode
MARKING DIAGRAM
xxx M G
G
1
xxx = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
BZX84CxxxET1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SZBZX84CxxxET1G SOT−23
(Pb−Free)
3,000 /
Tape & Reel
BZX84CxxxET3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
SZBZX84CxxxET3G SOT−23
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
BZX84C2V4ET1/D