BZX84C2V4ET1_09 Datasheet, PDF (1/6 Pages) ON Semiconductor – Zener Voltage Regulators 225 mW SOT−23 Surface Mount

BZX84C2V4ET1 Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Breakdown Voltage Range − 2.4 V to 75 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Peak Power − 225 W (8 X 20 ms)
• Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol Max Unit
Peak Power Dissipation @ 20 ms (Note 1)
@ T_L ≤ 25°C
P_pk
225
W
Total Power Dissipation on FR−5 Board,
(Note 2) @ T_A = 25°C
Derated above 25°C
P_D
225
mW
1.8 mW/°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina Sub-
strate, (Note 3) @ T_A = 25°C
Derated above 25°C
R_qJA
P_D
556 °C/W
300
mW
2.4 mW/°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
R_qJA
T_J, T_stg
417
−65 to
+150
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
© Semiconductor Components Industries, LLC, 2009
1
July, 2009 − Rev. 6
http://onsemi.com
3
Cathode
1
Anode
3
1
2
SOT−23
CASE 318
STYLE 8
MARKING DIAGRAM
xxx M G
G
1
xxx = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
BZX84CxxxET1 SOT−23 3000/Tape & Reel
BZX84CxxxET1G SOT−23 3000/Tape & Reel
(Pb−Free)
BZX84CxxxET3 SOT−23 10,000/Tape & Reel
BZX84CxxxET3G SOT−23 10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
BZX84C2V4ET1/D