BSS138L Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 200 mA, 50 V

BSS138L, BVSS138L
Power MOSFET
200 mA, 50 V
N−Channel SOT−23
Typical applications are DC−DC converters, power management in
portable and battery−powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Features
• Low Threshold Voltage (V_GS(th): 0.5 V−1.5 V) Makes it Ideal for
Low Voltage Applications
• Miniature SOT−23 Surface Mount Package Saves Board Space
• BVSS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
200 mA, 50 V
R_DS(on) = 3.5 W
N−Channel
3
1
MAXIMUM RATINGS (T_A = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
V_DSS
50
Vdc
Gate−to−Source Voltage − Continuous V_GS
± 20
Vdc
Drain Current
− Continuous @ T_A = 25°C
I_D
− Pulsed Drain Current (t_p ≤ 10 ms)
I_DM
mA
200
800
Total Power Dissipation @ T_A = 25°C
P_D
225
mW
Operating and Storage Temperature
T_J, T_stg − 55 to 150
°C
Range
Thermal Resistance,
Junction−to−Ambient
R_qJA
556
°C/W
Maximum Lead Temperature for
T_L
Soldering Purposes, for 10 seconds
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
3
1
2
SOT−23
CASE 318
STYLE 21
MARKING
DIAGRAM
J1 M G
G
1
J1
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
BSS138LT1G
SOT−23 3000 / Tape & Reel
(Pb−Free)
BVSS138LT1G SOT−23 3000 / Tape & Reel
(Pb−Free)
BSS138LT3G
SOT−23 10,000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
July, 2013 − Rev. 8
Publication Order Number:
BSS138LT1/D