BSP52T1_05 Datasheet, PDF (1/4 Pages) ON Semiconductor – NPN Small−Signal Darlington Transistor

BSP52T1, BSP52T3
Preferred Devices
NPN Small−Signal
Darlington Transistor
This NPN small signal Darlington transistor is designed for use in
switching applications, such as print hammer, relay, solenoid and lamp
drivers. The device is housed in the SOT-223 package, which is
designed for medium power surface mount applications.
Features
• The SOT-223 Package can be soldered using wave or reflow. The
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
• Available in 12 mm Tape and Reel
Use BSP52T1 to order the 7 inch/1000 unit reel
• PNP Complement is BSP62T1
• Pb−Free Packages are Available
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol
Max
Unit
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current
Total Power Dissipation (Note 1)
@ T_A = 25°C
Derate above 25°C
V_CES
V_CBO
V_EBO
I_C
P_D
80
Vdc
90
Vdc
5.0
Vdc
1.0
Adc
0.8
W
6.4
mW/°C
Total Power Dissipation (Note 2)
@ T_A = 25°C
Derate above 25°C
P_D
1.25
W
10
mW/°C
Operating and Storage
Temperature Range
T_J, T_stg −65 to 150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance (Note 1)
Junction-to-Ambient
Symbol
R_qJA
Value
156
Unit
°C/W
Thermal Resistance (Note 2)
Junction-to-Ambient
R_qJA
100
°C/W
Maximum Temperature for Soldering
Purposes
T_L
Time in Solder Bath
260
°C
10
Sec
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum
recommended footprint.
2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm² pad.
http://onsemi.com
MEDIUM POWER
NPN SILICON
SURFACE MOUNT
DARLINGTON TRANSISTOR
COLLECTOR 2,4
BASE
1
EMITTER 3
MARKING DIAGRAM
4
1
2
3
SOT−223
CASE 318E
STYLE 1
AYW
AS3G
G
A
= Assembly Location
Y
= Year
W
= Work Week
AS3 = Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
BSP52T1
SOT−223 1000/Tape & Reel
BSP52T1G
SOT−223 1000/Tape & Reel
(Pb−Free)
BSP52T3
SOT−223 4000/Tape & Reel
BSP52T3G
SOT−223 4000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2005
1
September, 2005 − Rev. 5
Publication Order Number:
BSP52T1/D