|
BD237 Datasheet, PDF (1/4 Pages) Motorola, Inc – Plastic Medium Power Silicon NPN Transistor | |||
|
BD237 (NPN), BD234 (PNP),
BD238 (PNP)
Preferred Devices
Plastic Medium Power
Bipolar Transistors
Designed for use in 5.0 to 10 W audio amplifiers and drivers
utilizing complementary or quasi complementary circuits.
http://onsemi.com
Features
⢠DC Current Gain â
hFE = 40 (Min) @ IC = 0.15 Adc
⢠Epoxy Meets UL 94 V0 @ 0.125 in
⢠ESD Ratings: Human Body Model, 3B; >8000 V
Machine Model, C; >400 V
⢠PbâFree Packages are Available*
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ MAXIMUM RATINGS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Rating
BD237
Symbol BD234 BD238 Unit
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorâEmitter Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ CollectorâBase Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ EmitterâBase Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Collector Current
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Base Current
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Total Device Dissipation
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ @ TC = 25_C
VCEO
45
80
Vdc
VCBO
60
100
Vdc
VEBO
5.0
Vdc
IC
2.0
Adc
IB
1.0
Adc
PD
25
W
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Operating and Storage Junction TJ, Tstg
â 55 to + 150
_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Temperature Range
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ THERMAL CHARACTERISTICS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Characteristic
Symbol
Max
Unit
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Thermal Resistance, JunctionâtoâCase
RqJC
5.0
_C/W
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
2.0 AMPERES
POWER TRANSISTORS
25 WATTS
321
TOâ225
CASE 77
STYLE 1
MARKING DIAGRAM
YWW
BD23xG
BD23x = Device Code
x
= 4, 7 or 8
Y
= Year
WW = Work Week
G
= PbâFree Package
ORDERING INFORMATION
Device
BD234
Package
TOâ225
Shipping
500 Units / Box
BD234G
BD237
TOâ225
(PbâFree)
TOâ225
500 Units / Box
500 Units / Box
BD237G
BD238
BD238G
TOâ225
(PbâFree)
TOâ225
TOâ225
(PbâFree)
500 Units / Box
500 Units / Box
500 Units / Box
*For additional information on our PbâFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2005
1
November, 2005 â Rev. 14
Publication Order Number:
BD237/D
|
▷ |