BCP53T1G Datasheet, PDF (1/5 Pages) ON Semiconductor – PNP Silicon Epitaxial Transistors

BCP53 Series,
SBCP53 Series
PNP Silicon
Epitaxial Transistors
This PNP Silicon Epitaxial transistor is designed for use in audio
amplifier applications. The device is housed in the SOT−223 package
which is designed for medium power surface mount applications.
• High Current: 1.5 A
• NPN Complement is BCP56
• The SOT−223 Package can be soldered using wave or reflow. The
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
• Device Marking:
BCP53T1 = AH
BCP53−10T1 = AH−10
BCP53−16T1 = AH−16
• AEC−Q101 Qualified and PPAP Capable
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Total Power Dissipation
@ T_A = 25°C (Note 1.)
Derate above 25°C
V_CEO
V_CBO
V_EBO
I_C
P_D
−80
Vdc
−100
Vdc
−5.0
Vdc
1.5
Adc
1.5
W
12
mW/°C
Operating and Storage
Temperature Range
T_J, T_stg
−65 to
°C
+150
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance,
Junction to Ambient
(surface mounted)
R_qJA
83.3
°C/W
Lead Temperature for Soldering,
0.0625″ from case
Time in Solder Bath
T_L
260
°C
10
s
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
© Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 8
http://onsemi.com
MEDIUM POWER HIGH
CURRENT SURFACE MOUNT
PNP TRANSISTORS
COLLECTOR 2,4
BASE
1
EMITTER 3
MARKING DIAGRAM
SOT−223
CASE 318E
STYLE 1
AYW
XXXXXG
G
1
A
= Assembly Location
Y
= Year
W
= Work Week
XXXXX = Specific Device Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
BCP53T1G
SOT−223
(Pb−Free)
1000 / Tape &
Reel
SBCP53−10T1G SOT−223
(Pb−Free)
1000 / Tape &
Reel
BCP53−10T1G
SOT−223
(Pb−Free)
1000 / Tape &
Reel
SBCP53−10T1G SOT−223
(Pb−Free)
1000 / Tape &
Reel
BCP53−16T1G
SBCP53−16T1G
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
1000 / Tape &
Reel
1000 / Tape &
Reel
BCP53−16T3G
SOT−223
(Pb−Free)
4000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
BCP53T1/D