BC846BPDW1T1G Datasheet, PDF (1/17 Pages) ON Semiconductor – Dual General Purpose Transistors

BC846BPDW1T1G,
BC847BPDW1T1G,
BC848CPDW1T1G
Dual General Purpose
Transistors
NPN/PNP Duals (Complementary)
http://onsemi.com
These transistors are designed for general purpose amplifier
applications. They are housed in the SOT−363/SC−88 which is
designed for low power surface mount applications.
Features
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS − NPN
Rating
Symbol
Value
Unit
Collector-Emitter Voltage BC846 V_CEO
65
V
BC847
45
BC848
30
Collector-Base Voltage
BC846 V_CBO
80
V
BC847
50
BC848
30
Emitter−Base Voltage
Collector Current − Continuous
MAXIMUM RATINGS − PNP
V_EBO
I_C
6.0
V
100
mAdc
Rating
Symbol
Value
Unit
Collector-Emitter Voltage BC846 V_CEO
−65
V
BC847
−45
BC848
−30
Collector-Base Voltage
BC846 V_CBO
−80
V
BC847
−50
BC848
−30
Emitter−Base Voltage
V_EBO
−5.0
V
Collector Current − Continuous
I_C
−100
mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommen-
ded Operating Conditions is not implied. Extended exposure to stresses
above the Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
P_D
Per Device
FR−5 Board (Note 1) T_A = 25°C
Derate above 25°C
380
mW
250
3.0
mW/°C
Thermal Resistance,
Junction−to−Ambient
R_qJA
328
°C/W
Junction and Storage Temperature
T_J, T_stg − 55 to +150
°C
1. FR−5 = 1.0 x 0.75 x 0.062 in.
(3)
(2)
(1)
Q₁
Q₂
(4)
(5)
(6)
MARKING
DIAGRAM
6
SOT−363
CASE 419B
1
STYLE 1
XX MG
G
1
XX = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Mark Package Shipping^†
BC846BPDW1T1G BB SOT−363
3000 /
(Pb−Free) Tape & Reel
BC847BPDW1T1G _BF SOT−363
3000 /
(Pb−Free) Tape & Reel
BC847BPDW1T2G BF SOT−363
3000 /
(Pb−Free) Tape & Reel
BC848CPDW1T1G BL SOT−363
3000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
1
October, 2010 − Rev. 6
Publication Order Number:
BC846BPDW1T1/D