BAW56L Datasheet, PDF (1/4 Pages) ON Semiconductor – Dual Switching Diode Common Anode

BAW56L, SBAW56L
Dual Switching Diode
Common Anode
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (EACH DIODE)
Rating
Symbol Value
Unit
Reverse Voltage
Forward Current
Forward Surge Current
(60 Hz @ 1 cycle)
V_R
70
V
I_F
200
mA
I_FSM
2.0
A
Non−Repetitive Peak Forward Current
I_FSM
4.0
A
t = 1 ms (Note 3)
Repetitive Peak Forward Current
I_FRM
500
mA
Pulse Wave = 1 sec, Duty Cycle = 66%
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR− 5 Board
P_D
225
mW
(Note 1) T_A = 25°C
Derate above 25°C
1.8
mW/°C
Thermal Resistance,
Junction−to−Ambient
R_qJA
556
°C/W
Total Device Dissipation
Alumina Substrate,
(Note 2) T_A = 25°C
Derate above 25°C
P_D
300
mW
2.4
mW/°C
Thermal Resistance,
Junction−to−Ambient
R_qJA
417
°C/W
Junction and Storage Temperature
T_J, T_stg
−55 to
°C
+150
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR− 5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
3. Square Wave; T_j = 25°C.
www.onsemi.com
SOT−23 (TO−236)
CASE 318
STYLE 12
ANODE
3
CATHODE
1
2
CATHODE
MARKING DIAGRAM
A1 M G
G
1
A1
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
BAW56LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SBAW56LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
BAW56LT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
SBAW56LT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1994
1
October, 2016 − Rev. 10
Publication Order Number:
BAW56LT1/D