BAV99L Datasheet, PDF (1/3 Pages) Taiwan Semiconductor Company, Ltd – 225mW SMD Switching Diode

BAV99L, SBAV99L
Dual Series
Switching Diode
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (Each Diode)
Rating
Symbol Value Unit
Reverse Voltage
V_R
100
Forward Current
I_F
215
Peak Forward Surge Current
I_FM(surge) 500
Repetitive Peak Reverse Voltage
V_RRM
100
Average Rectified Forward Current (Note 1)
I_F(AV)
715
(averaged over any 20 ms period)
Vdc
mAdc
mAdc
V
mA
Repetitive Peak Forward Current
Non−Repetitive Peak Forward Current
t = 1.0 ms
t = 1.0 ms
t = 1.0 s
I_FRM
450
mA
I_FSM
A
2.0
1.0
0.5
Stresses exceeding those listed in the Maximum Ratings table may damage
the device. If any of these limits are exceeded, device functionality should not
be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max Unit
Total Device Dissipation
FR− 5 Board (Note 1) T_A = 25°C
Derate above 25°C
P_D
225
mW
1.8 mW/°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation
Alumina Substrate (Note 2)
T_A = 25°C
Derate above 25°C
R_qJA
P_D
556 °C/W
300
mW
2.4 mW/°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage
Temperature Range
R_qJA
T_J, T_stg
1. FR− 5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in 99.5% alumina.
417
−65 to
+150
°C/W
°C
www.onsemi.com
CASE 318
SOT−23
STYLE 11
ANODE
1
CATHODE
2
3
CATHODE/ANODE
MARKING DIAGRAM
A7 MG
G
1
A7 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
BAV99LT1G
SBAV99LT1G
BAV99LT3G
SBAV99LT3G
Package
Shipping^†
SOT−23 3,000 / Tape & Reel
(Pb−Free)
SOT−23 3,000 / Tape & Reel
(Pb−Free)
SOT−23 10,000 / Tape & Reel
(Pb−Free)
SOT−23 10,000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1994
1
October, 2016 − Rev. 12
Publication Order Number:
BAV99LT1/D