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BAS16XV2T1 Datasheet, PDF (1/4 Pages) ON Semiconductor – Switching Diode | |||
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BAS16XV2T1
Preferred Device
Switching Diode
⢠HighâSpeed Switching Applications
⢠Lead Finish: 100% Matte Sn (Tin)
⢠Qualified Reflow Temperature: 260°C
⢠Extremely Small SODâ523 Package
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Continuous Reverse Voltage
VR
75
Vdc
Peak Forward Current
IF
200
mAdc
Peak Forward Surge Current
IFM(surge)
500
mAdc
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limits are exceeded,
device functional operation is not implied, damage may occur and reliability may
be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max
Unit
Total Device Dissipation
FR-5 Board (Note 1)
TA = 25°C
Derate above 25°C
PD
200
mW
1.57 mW/°C
Thermal Resistance
JunctionâtoâAmbient
RθJA
635
°C/W
Junction and Storage Temperature
TJ, Tstg â55 to
°C
150
1. FR-4 Minimum Pad.
2. 300 mW for 1 in. copper.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(VR = 75 Vdc)
(VR = 75 Vdc, TJ = 150°C)
(VR = 25 Vdc, TJ = 150°C)
Reverse Breakdown Voltage
(IBR = 100 mAdc)
Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)
Diode Capacitance (VR = 0, f = 1.0 MHz)
Forward Recovery Voltage
(IF = 10 mAdc, tr = 20 ns)
Reverse Recovery Time
(IF = IR = 10 mAdc, RL = 50 Ω)
Stored Charge
(IF = 10 mAdc to VR = 5.0 Vdc,
RL = 500 Ω)
IR
V(BR)
VF
CD
VFR
trr
QS
mAdc
â
1.0
â
50
â
30
75
â Vdc
mV
â
715
â
855
â 1000
â 1250
â
2.0 pF
â 1.75 Vdc
â
6.0 ns
â
45 pC
http://onsemi.com
1
CATHODE
2
ANODE
2
1
SODâ523
CASE 502
PLASTIC
MARKING
DIAGRAM
A6 MG
1
G
2
A6 = Specific Device Code
M = Month Code
G = PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BAS16XV2T1
Package
Shippingâ
SODâ523 3000/Tape & Reel
BAS16XV2T1G SODâ523 3000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2005
1
September, 2005 â Rev. 3
Publication Order Number:
BAS16XV2T1/D
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