 English |
|
|
|
|
|
|
|
| BAS16L Datasheet, PDF (1/4 Pages) NXP Semiconductors – High-speed diode | |||
| |||
|
BAS16L, SBAS16L
Switching Diode
Features
⢠S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECâQ101 Qualified and
PPAP Capable
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
100
V
Peak Forward Current
IF
200
mA
NonâRepetitive Peak Forward Surge IFSM(surge)
500
mA
Current 60 Hz
Repetitive Peak Forward Current
(Note 3)
IFRM
1.0
A
NonâRepetitive Peak Forward Current
IFSM
A
(Square Wave, TJ = 25°C prior to
surge)
t = 1 ms
36.0
t = 10 ms
18.0
t = 100 ms
6.0
t = 1 ms
3.0
t=1s
0.7
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FRâ 5 Board
PD
(Note 1)
TA = 25°C
Derate above 25°C
225
mW
1.8
mW/°C
Thermal Resistance,
JunctionâtoâAmbient
Total Device Dissipation
Alumina Substrate, (Note 2)
TA = 25°C
Derate above 25°C
RqJA
PD
556
°C/W
300
mW
2.4
mW/°C
Thermal Resistance,
JunctionâtoâAmbient
RqJA
Junction and Storage Temperature
TJ, Tstg
1. FRâ 5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
3. Square Wave, f = 40 kHz, PW = 200 ns
Test Duration = 60 s, TJ = 25°C prior to surge.
417
â55 to +150
°C/W
°C
www.onsemi.com
3
CATHODE
1
ANODE
3
1
2
SOTâ23
CASE 318
STYLE 8
MARKING
DIAGRAM
A6 M G
G
1
A6 = Specific Device Code
M = Date Code*
G = PbâFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shippingâ
BAS16LT1G
SOTâ23 3000/Tape & Reel
(PbâFree)
BAS16LT3G
SOTâ23 10000/Tape & Reel
(PbâFree)
SBAS16LT1G SOTâ23 3000/Tape & Reel
(PbâFree)
SBAS16LT3G SOTâ23 10000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1994
1
October, 2016 â Rev. 12
Publication Order Number:
BAS16LT1/D
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese