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BAL99LT1 Datasheet, PDF (1/4 Pages) Motorola, Inc – CASE 318-08, STYLE 18 SOT-23 (TO-236AB)
BAL99LT1
Switching Diode
Features
• Pb−Free Package is Available
http://onsemi.com
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
70
Vdc
Peak Forward Current
IF
100
mAdc
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR− 5 Board PD
(Note 1), TA = 25°C
Derate above 25°C
225
mW
1.8
mW/°C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25°C
Derate above 25°C
RqJA
PD
556
°C/W
300
mW
2.4
mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA
417
Junction and Storage Temperature TJ, Tstg
1. FR−5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in 99.5% alumina.
−55 to +150
°C/W
°C
ANODE
3
CATHODE
2
3
1
2
SOT−23
CASE 318
STYLE 18
MARKING DIAGRAM
JF M
JF
Specific Device Code
M
= Date Code
ORDERING INFORMATION
Device
BAL99LT1
BAL99LT1G
Package
SOT−23
SOT−23
(Pb−Free)
Shipping†
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
July, 2004 − Rev. 3
Publication Order Number:
BAL99LT1/D