B300W35A109XXG Datasheet, PDF (1/31 Pages) ON Semiconductor – Audio Processor for Portable Communication Devices

BelaSigna 300
Audio Processor for Portable
Communication Devices
Introduction
BelaSigna^® 300 is a DSP−based mixed−signal audio processing
system that delivers superior audio clarity without compromising size
or battery life. The processor is specifically designed for monaural
portable communication devices requiring high performance audio
processing capabilities and programming flexibility when form−factor
and power consumption are key design constraints.
The efficient dual−MAC 24−bit CFX DSP core, together with the
HEAR configurable accelerator signal processing engine, high speed
debugging interface, advanced algorithm security system, state−of−
the−art analog front end, Class D output stage and much more,
constitute an entire system on a single chip, which enables
manufacturers to create a range of advanced and unique products. The
system features a high level of instructional parallelism, providing
highly efficient computing capability. It can simultaneously execute
multiple advanced adaptive noise reduction and echo cancellation
algorithms, and uses an asymmetric dual−core patented architecture to
allow for more processing in fewer clock cycles, resulting in reduced
power consumption.
BelaSigna 300 is supported by a comprehensive suite of
development tools, hands−on training, full technical support and a
network of solution partners offering software and engineering
services to help speed product design and shorten time to market.
Key Features
• Flexible DSP−based System: a complete DSP−based, mixed−signal
audio system consisting of the CFX core, a fully programmable,
highly cycle−efficient, dual−Harvard architecture 24−bit DSP
utilizing explicit parallelism; the HEAR configurable accelerator for
optimized signal processing; and an efficient input/output controller
(IOC) along with a full complement of peripherals and interfaces,
which optimize the architecture for audio processing at extremely
low power consumption
• Ultra−low−power: typically 1−5 mA
• Excellent Audio Fidelity: up to 110 dB input dynamic range,
exceptionally low system noise and low group delay
• Miniature Form Factor: available in a miniature 3.63 mm x
2.68 mm x 0.92 mm (including solder balls) WLCSP package. In
addition, BelaSigna 300 is also available in a bigger DFN package
allowing easier assembly and PCB routing
• Multiple Audio Input Sources: four input channels from five input
sources (depends on package selection) can be used simultaneously
for multiple microphones or direct analog audio inputs
• Full Range of Configurable Interfaces: including a fast I²C−based
interface for download, debug and general communication, a highly
configurable PCM interface to stream data into and out of the device,
a high−speed UART, an SPI port and 5 GPIOs
www.onsemi.com
DFN−44
D SUFFIX
CASE 506BU
WLCSP−35
W SUFFIX
CASE 567AG
MARKING DIAGRAM
BELASIGNA300
35−02−G
XXXXYZZ
BELASIGNA300 = Device Code
35
= Number of Balls
02
= Revision of Die
G
= Pb−Free
XXXX = Date Code
Y
= Assembly Plant Identifier
= (May be Two Characters)
ZZ
= Traceability Code
ORDERING INFORMATION
Device
Package
Shipping^†
B300W35A109XXG WLCSP 2500 / Tape &
(Pb−Free)
Reel
B300D44A103XXG
DFN
2500 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
February, 2015 − Rev. 8
Publication Order Number:
B300/D